The i-Technology Media!
Register | Log in
   
 
.NET  ·  AJAX  ·  CLOUD  ·  ECLIPSE  ·  FLEX  ·  OPEN WEB  ·  iPHONE  ·  JAVA  ·  LINUX  ·  OPEN SOURCE  ·  ORACLE  ·  PBDJ  ·  SEARCH  ·  SILVERLIGHT  ·  SOA  ·  VIRTUALIZATION  ·  WEB 2.0  ·  WIRELESS  ·  XML
Comments
Drool, Britannia? Is the UK Failing the Cloud?
By Roger Strukhoff
Richard Davies wrote: The UK has a good crop of technology pioneers in cloud computing - for example ElasticHosts, FlexiScale, Flexiant, OnApp - and also some strong government initiatives such as G-Cloud. We will have to see whether this kind of technical leadership converts into swift mass-market adoption or not.
Jan. 8, 2012 11:38 AM EST
read more & respond »
Cloud Expo on Google News
Did you read today's front page stories & breaking news?

Cloud Expo & Virtualization 2011 West
Keynotes
Oracle
Opening Keynote | An Enterprise Cloud for Business-Critical Applications
Abiquo
Day 2 Keynote | The Enterprise Cloud Tightrope - Balancing for Success
Akamai
Day 3 Keynote | The DNA of an Enterprise Cloud
DIAMOND SPONSOR:
Oracle
Many Clouds, Many Choices'Cloud
PLATINUM PLUS SPONSORS:
Abiquo
Enterprise Cloud Best Practices - Town Hall - Join the discussion…
PLATINUM SPONSORS:
Intel
Progressing Toward the Federated, Automated and Client-Aware Cloud
New Relic
How to build an app with Twitter-like throughput
Rackspace
Computing in the Cloud Era
GOLD SPONSORS:
Gale Technologies
Practical Cloud Migration
IBM
Re-think IT. Re-inventing Business.
Intel/McAfee
Identity Driven Security in the Cloud
PerspecSys
Hackers Hackers Everywhere, Is My Public Cloud That Safe?
Red Hat
Unlock the Value of the Cloud
SHI
Mission Critical Applications and the Cloud - Myth or Reality?
SoftLayer
Not Your Grandpa's Cloud
Terremark
Integrating Enterprise Clouds
VMware
Upgrade to a vCloud
POWER PANELS:
Cloud Expo Silicon Valley: CTO Power Panel
Cloud Expo Silicon Valley: CEO Power Panel
Cloud Expo Silicon Valley: Cloud SuperStars Panel
Cloud Expo Silicon Valley: CloudNOW Panel
Click For 2010 West
Event Webcasts
Cloud Expo & Virtualization 2011 East
DIAMOND SPONSOR:
Dell
Dell & VMware Deliver the Enterprise Hybrid Cloud
PLATINUM PLUS SPONSORS:
Abiquo
Are Financial Services Organizations Risking Security by Avoiding Cloud Computing?
Oracle
From Consolidation to Enterprise Private PaaS
PLATINUM SPONSORS:
Intel
Driving the Transformation to Next Generation Cloud Data Centers
Rackspace
The Inevitability of an Open Cloud
GOLD SPONSORS:
CA Technologies
Follow YOUR path to Cloud Computing
Interxion
Who Keeps the Cloud in the Air?
Microsoft
Patterns for Cloud Computing
PerspecSys
War in the Clouds: Are you ready?
ServiceMesh
The Big Win: Stop Playing Small-Ball with Your Cloud Strategy
Terremark
Evaluating Enterprise Clouds
Xiotech
Cloud Storage: Myths and Realities
POWER PANELS:
Cloud Expo New York: CTO Power Panel
Cloud Expo New York: CEO Power Panel
Cloud Expo New York: CMO Power Panel
Cloud Expo New York: Wrap-Up Power Panel
Click For 2010 West
Event Webcasts
Live Google News by SYS-CON!
Top Three Links You Must Click On


From the Wires
Dow Electronic Materials Introduces New Products for Printed Circuit Boards at Productronica Show

By: Business Wire
Nov. 9, 2009 03:01 AM

Dow Electronic Materials will introduce its new line of products for printed circuit board (PCB) manufacture at this year’s Productronica show (Stand 305, Hall 2, New Munich Trade Fair Center, Germany) on November 10-13. These new products improve performance and reliability, and help meet the electronics industry’s requirements for miniaturization, enhanced performance, reduced costs, and reduced environmental impact.

For PCB Imaging, LAMINAR™ UD-900 Dry Film photoresist for laser direct imaging has demonstrated capability in a wide range of plating and etching applications. PHOTOPOSIT™ SN68 Photoresist is a robust, high-yielding, fine line, cost effective photoresist that can be utilized in manual and automatic exposure equipment at optimum productivity levels. LITHOJET™ Inkjet Materials offer print and etch solutions while significantly reducing waste generation; for some customers, use of these materials may result in waste generation reduction of up to approximately 85 percent. LITHOJET™ 210 Etch Resist is a new UV-curable acrylic hybrid ink that can dramatically improve yield and quality, as well as reduce manufacturing cost.

For PCB Making Holes Conductive, CIRCUPOSITTM 3000-1 Electroless Copper is a universal plating through hole process capable of low build or high build, basket or rack, and vertical, conveyorized vertical or horizontal applications.

For PCB Electrolytic Plating, MICROFILLTM EVF Copper Via Fill addresses the demand for high density interconnect products using filled microvias: fast filling at low surface copper is achieved. For conventional through hole plating, COPPER GLEAMTM HT-55 Copper Electroplate provides exceptional surface distribution and throwing power.

For PCB Final Finish, Dow Electronic Materials continues to invest in the development of new solderable final finishes for the PCB market and extends its product offering with SILVERONTM MF 100 Autocatalytic Silver. This new product offers a true multi-functional finish for reflow or wire bond without nickel or thick gold. It also compliments our existing electroless nickel immersion gold and electroless nickel electroless palladium immersion gold processes using DURAPOSITTM SMT 88 Electroless Nickel; PALLAMERSETM SMT 2000 Electroless Palladium and AUROLECTROLESSTM SMT Immersion Gold.

"The market drive for miniaturization, enhanced performance, reduced environmental impact and lower costs marches onwards,” said Bob Ferguson, global general manager for Dow Electronic Materials. “Dow Electronic Materials is committed to developing technology that improves performance, reliability and sustainability for the PCB industry. Our leading technologies, excellent customer support and extensive global footprint enable us to keep on delivering next generation solutions for the electronic market,” he said.

To learn more about our product and offerings, visit us @ go.rohmhaas.com/dow/electronicmaterials

®™ Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow.

About Dow

Dow is a diversified chemical company that combines the power of science and technology with the “Human Element” to constantly improve what is essential to human progress. The Company delivers a broad range of products and services to customers in approximately 160 countries, connecting chemistry and innovation with the principles of sustainability to help provide everything from fresh water, food and pharmaceuticals to paints, packaging and personal care products. In 2008, Dow had annual sales of $57.4 billion and employed approximately 46,000 people worldwide. The Company has 150 manufacturing sites in 35 countries and produces approximately 3,300 products. On April 1, 2009, Dow acquired Rohm and Haas Company, a global specialty materials company with sales of $10 billion in 2008, 98 manufacturing sites in 30 countries and approximately 15,000 employees worldwide. References to “Dow” or the “Company” mean The Dow Chemical Company and its consolidated subsidiaries unless otherwise expressly noted. More information about Dow can be found at www.dow.com.

About Dow Electronic Materials

Dow Electronic Materials, a global supplier of materials and technologies to the electronics industry, brings innovative leadership to the semiconductor, interconnect, finishing, photovoltaic, display, LED and optics markets. From advanced technology centres worldwide, teams of talented Dow research scientists and application experts work closely with customers, providing solutions, products and technical service necessary for next-generation electronics. These partnerships energize Dow’s power to invent. Its key end-use applications include a broad range of consumer electronics from personal computers, to television monitors, cellular phones, global positioning systems, automobile safety systems, and avionics.

Published Nov. 9, 2009— Reads 226
Copyright © 2009 SYS-CON Media, Inc. — All Rights Reserved.
Syndicated stories and blog feeds, all rights reserved by the author.
About Business Wire
Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Subscribe to the World's Most Powerful Newsletters
Subscribe to Our Rss Feeds & Get Your SYS-CON News Live!
Click to Add our RSS Feeds to the Service of Your Choice:
Google Reader or Homepage Add to My Yahoo! Subscribe with Bloglines Subscribe in NewsGator Online
myFeedster Add to My AOL Subscribe in Rojo Add 'Hugg' to Newsburst from CNET News.com Kinja Digest View Additional SYS-CON Feeds
Publish Your Article! Please send it to editorial(at)sys-con.com!

Advertise on this site! Contact advertising(at)sys-con.com! 201 802-3021

SYS-CON Featured Whitepapers

ADS BY GOOGLE

Breaking Java News
111th Canton Fair Opens in April
Honeywell Advanced Avionics Technology to Provide JEJU AIR With Operational Efficiencies
Honeywell Equips Eastar Jet With Auxiliary Power Units, Enhancing Engine Efficiencies and Fleet Performance
111th Canton Fair Opens in April
Firestone Closes Private Placement and Extends Expiry Date of Outstanding Warrants
GoodTherapy.org Reaches Company Milestones
Blink-182 Announces May Tour Surrounding Bamboozle Headlining Performance
Butterball Employees Arrested for Cruelty to Animals, Reports Mercy For Animals
REBgold Closes Private Placement
Zargon Oil & Gas Ltd. Provides Operational Update and Releases 2011 Year End Reserves

ADVERTISE   |   MAGAZINE SUBSCRIPTIONS   |   FREE BREAKING-NEWSLETTERS!   |   SYS-CON.TV   |   BLOG-N-PLAY!   |   WEBCAST   |   EDUCATION   |   RESEARCH

.NET Developer's Journal - .NETDJ   |   ColdFusion Developer's Journal - CFDJ   |   Eclipse Developer's Journal - EDJ   |   Enterprise Open Source Magazine - EOS
Open Web Developer's Journal - OPENWEB   |   iPhone Developer's Journal - iPHONE   |   Virtualization - Virtualization   |   Java Developer's Journal - JDJ   |   Linux.SYS-CON.com
PowerBuilder Developer's Journal - PBDJ   |   SEO / SEM Journal - SJ   |   SOAWorld Magazine - SOAWM   |   IT Solutions Guide - ITSG   |   Symbian Developer's Journal - SDJ
WebLogic Developer's Journal - WLDJ   |   WebSphere Journal - WJ   |   Wireless Business & Technology - WBT   |   XML-Journal - XMLJ   |   Internet Video - iTV
Flex Developer's Journal - Flex   |   AJAXWorld Magazine - AWM   |   Silverlight Developer's Journal - SLDJ   |   PHP.SYS-CON.com   |   Web 2.0 Journal - WEB2
Apache   |   CMS   |   CRM   |   HP   |   Oracle Journal   |   Perl   |   Python   |   Red Hat   |   Ruby on Rails   |   SAP   |   SaaS

SYS-CON MEDIA:   ABOUT US   |   CONTACT US   |   COMPANY NEWS   |   CAREERS   |   SITE MAP
SYS-CON EVENTS:   |  AJAXWorld Conference & Expo  |  iPhone Developer Summit  |  Cloud Computing Conference & Expo  |  SOA World Conference & Expo  |  Virtualization Conference & Expo
INTERNATIONAL SITES:   India  |  U.K.  |  Canada  |  Germany  |  France  |  Australia  |  Italy  |  Spain  |  Netherlands  |  Brazil  |  Belgium
 Terms of Use & Our Privacy Statement     About Newsfeeds / Video Feeds
Copyright ©1994-2008 SYS-CON Publications, Inc. All Rights Reserved. All marks are trademarks of SYS-CON Media.
Reproduction in whole or in part in any form or medium without express written permission of SYS-CON Publications, Inc. is prohibited.
 
close this window