SINGAPORE - 11/24/2009, UNITED STATES -- (Marketwire) -- 11/23/09 -- STATS ChipPAC Ltd.
("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading
semiconductor test and advanced packaging service provider, announced today
that its copper wire bond program is in volume production with the
capability to support customers in five different manufacturing locations
in Asia.
As the semiconductor industry continues to deliver high performance and
cost effective solutions, copper wire bonding has demonstrated feasibility
as a low cost alternative. Copper wire bonding provides performance
advantages over traditional gold wire bonding including significantly
better conductivity than gold or aluminum, improved electrical and thermal
performance, and stronger mechanical properties.
Today, STATS ChipPAC has copper wire bond capabilities in its manufacturing
locations in Malaysia, Singapore, South Korea, China and Thailand. The
Company has been implementing process capabilities for wafer nodes ranging
from 250nm down to 45nm.
"We see demand for copper wire bond gaining momentum as a low cost, high
performance manufacturing solution for fine-pitch and ultra-fine pitch
bonding," said Wan Choong Hoe, Executive Vice President and Chief Operating
Officer, STATS ChipPAC. "We are currently qualified on Quad Flat No-Lead
(QFN) packages and volume production ramp is ongoing to meet the growth in
copper wire bond demand in these packages. We are furthering our
development work on more advanced wafer nodes and finer pad pitches as well
as on Quad Flat Pack (QFP) and Fine Pitch Ball Grid Array (FBGA) packages
as we expect copper wire bond demand to accelerate in 2010."
Forward-Looking Statements
Certain statements in this release are forward-looking statements that
involve a number of risks and uncertainties that could cause actual events
or results to differ materially from those described in this release.
Factors that could cause actual results to differ include, but are not
limited to, deterioration in general business and economic conditions and
the state of the semiconductor industry; prevailing market conditions;
demand for end-use applications products such as communications equipment,
consumer and multi-applications and personal computers; decisions by
customers to discontinue outsourcing of test and packaging services; level
of competition; our reliance on a small group of principal customers; our
continued success in technological innovations; customer credit risks;
possible future application of push-down accounting; pricing pressures,
including declines in average selling prices; intellectual property rights
disputes and litigation; our ability to control operating expenses; our
substantial level of indebtedness and access to credit markets; our ability
to generate cash; potential impairment charges; availability of financing;
adverse tax and other financial consequences if the taxing authorities do
not agree with our interpretation of the applicable tax laws;
classification of the Company as a passive foreign investment company; our
ability to develop and protect our intellectual property; rescheduling or
canceling of customer orders; changes in our product mix; our capacity
utilization; delays in acquiring or installing new equipment; limitations
imposed by our financing arrangements which may limit our ability to
maintain and grow our business; returns from research and development
investments; changes in customer order patterns; shortages in supply of key
components; disruption of our operations; loss of key management or other
personnel; defects or malfunctions in our testing equipment or packages;
changes in environmental laws and regulations; our ability to meet specific
conditions imposed for the continued listing or delisting of our ordinary
shares on the Singapore Exchange Securities Trading Limited (SGX-ST);
exchange rate fluctuations; regulatory approvals for further investments in
our subsidiaries; majority ownership by Temasek Holdings (Private) Limited
("Temasek") that may result in conflicting interests with Temasek and our
affiliates; unsuccessful acquisitions and investments in other companies
and businesses; labor union problems in South Korea; uncertainties of
conducting business in China and changes in laws, currency policy and
political instability in other countries in Asia; natural calamities and
disasters, including outbreaks of epidemics and communicable diseases; and
other risks described from time to time in the Company's filings with the
U.S. Securities and Exchange Commission, including its annual report on
Form 20-F dated March 9, 2009. You should not unduly rely on such
statements. We do not intend, and do not assume any obligation, to update
any forward-looking statements to reflect subsequent events or
circumstances.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging
design, assembly, test and distribution solutions in diverse end market
applications including communications, digital consumer and computing. With
global headquarters in Singapore, STATS ChipPAC has design, research and
development, manufacturing or customer support offices in 10 different
countries. STATS ChipPAC is listed on the SGX-ST. Further information is
available at www.statschippac.com. Information contained in this website
does not constitute a part of this release.
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