MIDLAND, Mich., Dec. 6 /PRNewswire/ -- Dow Corning Compound Semiconductor Solutions has been awarded a $3.6 million contract from the U.S. Office of Naval Research to develop semiconductor silicon carbide (SiC) materials technology. This technology is essential for the development of wide bandgap devices which bolster emerging high-frequency and high-power electronics applications, including advanced radar systems, cell phone base systems, hybrid electric vehicles and power grid networks.

Dow Corning Compound Semiconductor Solutions will use the funds to promote rapid growth of its manufacturing capability for producing device-quality SiC substrates up to 100mm in diameter.

"Dow Corning is committed to developing leading-edge materials to support the objectives of the Navy," said Robert Johns, Global Director, New Business Development Programs, Advanced Technologies & Ventures Business for Dow Corning. "We've set our sights on being a fully integrated SiC substrate manufacturer in Michigan and look forward to unlocking a vast array of unprecedented electronics capabilities for all our customers as a result."

Michigan Senator Carl Levin, a member of the Senate Armed Services Committee, is a champion for increased defense spending on new technologies such as SiC materials that can increase the effectiveness of the nation's armed forces. "This technology is critical to many advanced military electronic systems, such as high performance Navy radar systems and electric vehicles under development at the U.S. Army Tank Automotive Research, Development and Engineering Center (TARDEC) in Warren, Michigan," Levin said. "Growing the semiconductor industry in Michigan will generate new manufacturing opportunities for our skilled work force."

Michigan Governor Jennifer Granholm commented, "This Navy contract is exactly the type of investment we will see more of in Michigan as we accelerate growth in emerging high technology manufacturing."

Dow Corning first expanded into SiC technology development in 2003. The SiC development work is underway at Dow Corning's Auburn, Mich.-based manufacturing site, which the company dedicated last year following the launch of the Compound Semiconductor Solutions business (http://www.dowcorning.com/compoundsemiconductor ).

Dow Corning Compound Semiconductor Solutions, LLC is a wholly owned subsidiary of Dow Corning Corporation. Dow Corning (http://www.dowcorning.com/ ) provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. A global leader in silicon-based technology and innovation, offering more than 7,000 products and services, Dow Corning is equally owned by The Dow Chemical Company and Corning,

Incorporated.

Title: "Known-Good" Semiconductor Substrates for High Power Electronics Systems

Contract number is N00014-05-C-0324

CONTACT: Company Contact: Don Piering of Dow Corning, +1-989-496-8972,
don.piering@dowcorning.com ; Agency Contact: Bruce Hokanson of Loomis Group,
+1-360-574-4000, hokanson@loomisgroup.com

Web site: http://www.dowcorning.com/compoundsemiconductor
http://www.dowcorning.com/