Research and Markets (http://www.researchandmarkets.com/research/5tpqkf/st_lsm330_6axis_m) has announced the addition of the "ST LSM330 6-axis MEMS Inertial Module 3D Accelerometer + 3D Gyroscope" report to their offering.

System Plus Consulting is proud to publish the reverse costing report of the new 6-axis MEMS Inertial Module supplied by STMicroelectronics.

The LSM330D is a system-in-package featuring a 3axis accelerometer and a 3-axis gyroscope. With a 3x5.5x1mm size, it belongs to the smallest inertial modules for consumer applications. It is manufactured with the same ST THELMA process used for more than 1.5billon MEMS devices.

The LSM330D is targeted for consumer applications: GPS navigation systems, Impact recognition and logging, Gaming.

This Report Provides Complete Teardown of the MEMS IMU With:

- Detailed photos

- Material analysis

- Schematic assembly description

- Manufacturing Process Flow

- In-depth economical analysis

- Manufacturing cost breakdown

- Selling price estimation

Key Topics Covered:

- Glossary

- Overview/Introduction

- ST Company Profile

- Physical analysis

- ASIC - Dimensions

- ASIC - Markings

- ASIC - Delayering

- ASIC - Cross-Section

- MEMS - Dimensions

- MEMS - Markings

- MEMS - Bond Pads Opening

- MEMS - Cap Opening

-MEMS - Cap

- MEMS - Sensing Area

- MEMS - Cross-section

- Manufacturing Process Flow

- Cost Analysis

- Estimated Price Analysis

- Conclusion

For more information visit http://www.researchandmarkets.com/research/5tpqkf/st_lsm330_6axis_m