|By Business Wire||
|November 23, 2012 04:23 AM EST||
Research and Markets (http://www.researchandmarkets.com/research/7xtptx/stmicro) has announced the addition of the "STMicro Wafer-Level Camera - WLP CIS + Heptagon WL-Optic Reverse Costing" report to their offering.
System Plus Consulting is proud to publish the reverse costing report of the VGA Camera Module supplied by ST Microelectronics for the Nokia 2330 mobile phone. This camera module integrates an 2.2µm pixel CMOS Image Sensor (CIS) from STMicro. The CIS die is manufactured using a CMOS technology with a 0.18µm process. The CIS is Wafer-Level Packaged (WLP) using a TSV "via last" technology. The optical module comes from Heptagon and is manufactured with a wafer-level approach.
- Physical Analysis of the Camera and the CMOS Image Sensor
- Step by Step Reconstruction of the Process Flow
- Cost of Manufacturing and Estimation of Selling Price
This report provides complete teardown of the camera module with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
Key Topics Covered:
- Executive Summary
- Reverse Costing Methodology
- CMOS Image Sensors. Volume Shipments
- STMicroelectronics Profile
- Heptagon Profile
Nokia 2330 Teardown
- Camera Module Views & Dimensions
- Camera X-Ray
- Camera Module Disassembly
- CIS Views & Dimensions
- CIS Markings
- CIS Bonding
- CIS Microlenses
- CIS Pixels
- CIS Back view
- Camera Module Cross-section
- Package Cross-section
- Optical Module Cross-section
- CIS Packaging Cross-section
- CIS Cross-section
Manufacturing Process Flow
- CIS Process Flow
- CIS Wafer-level packaging Process Flow
- Description of the CIS Wafer Fabrication Unit
- WL-Optic Process Flow
- Description of the WL-Optic Wafer Fabrication Unit
- CIS FEOL + BEOL Cost
- CIS Front-End Cost
- CIS Back-End 0 : 1st Probe Test & Optical Test
- CIS WLP Cost
- CIS WLP Cost per Process Steps
- CIS WLP : Equipment Cost per Family
- CIS WLP : Material Cost per Family
- CIS Die Cost
- WL-Optic Front-End Cost
- WL-Optic Cost per Process Steps
- WL-Optic : Equipment Cost per Family
- WL-Optic : Material Cost per Family
- WL-Optic : Test, dicing and assembly
- WL-Optic Price
- Back-End : Final Packaging & Test
- Camera Module Cost (CIS + WLO + Packaging)
Estimated Price Analysis Conclusion
For more information visit http://www.researchandmarkets.com/research/7xtptx/stmicro
Can we look to the paradigm of cloud computing from a completely different perspective? In his General Session at 15th Cloud Expo, Gundars Kulups, Sales Director at DEAC, will discuss what we can learn from our dining habits when choosing a cloud solution. Gundars Kulups is Sales Director at DEAC, full service data center operator. An IT expert, he specializes in European countries and has worke...
Oct. 31, 2014 10:00 PM EDT Reads: 894
The 4th International DevOps Summit, co-located with16th International Cloud Expo – being held June 9-11, 2015, at the Javits Center in New York City, NY – announces that its Call for Papers is now open. Born out of proven success in agile development, cloud computing, and process automation, DevOps is a macro trend you cannot afford to miss. From showcase success stories from early adopters and ...
Oct. 31, 2014 08:15 PM EDT Reads: 2,180
SYS-CON Events announced today that SOA Software, an API management leader, will exhibit at SYS-CON's 15th International Cloud Expo®, which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. SOA Software is a leading provider of API Management and SOA Governance products that equip business to deliver APIs and SOA together to drive their company to mee...
Oct. 31, 2014 07:15 PM EDT Reads: 2,105
As cloud gives an opportunity to businesses to buy services externally - how is cloud impacting your customers? In his General Session at 15th Cloud Expo, Fabio Gori, Director of Worldwide Cloud Marketing at Cisco, will provide answers to big questions: Do you see hybrid cloud as where the world is going? What benefits does it bring? And how does Cisco connect all of these clouds? He will also te...
Oct. 31, 2014 07:00 PM EDT Reads: 1,000
SYS-CON Events announced today that Aria Systems, the recurring revenue expert, has been named "Bronze Sponsor" of SYS-CON's 15th International Cloud Expo®, which will take place on November 4-6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. Aria Systems helps leading businesses connect their customers with the products and services they love. Industry leaders like Pitney Bowes, E...
Oct. 31, 2014 06:30 PM EDT Reads: 2,171
SYS-CON Events announced today that TMCnet has been named “Media Sponsor” of SYS-CON's 15th International Cloud Expo®, which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. Technology Marketing Corporation (TMC) is the world's leading business to business and integrated marketing media company, servicing niche markets within the communications and t...
Oct. 31, 2014 06:30 PM EDT Reads: 991
We live in a time when seconds – even milliseconds – can have a dramatic economic impact on your company’s future. With technology being the primary conduit for consumer interaction, the user experience is at center stage. User experience will be a deciding factor in separating the future winners from the losers. By building more speed and agility into the application delivery process, DevOps prom...
Oct. 31, 2014 06:00 PM EDT Reads: 1,441
SYS-CON Events announced today that AgilePoint, the leading provider of Microsoft-centric Business Process Management software, will exhibit at SYS-CON's 2nd International @ThingsExpo which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. AgilePoint is the leading provider of Microsoft-based Business Process Management (BPM) software products, has 1,...
Oct. 31, 2014 05:00 PM EDT Reads: 1,250
SYS-CON Events announced today that Parasoft will exhibit at SYS-CON's 15th International Cloud Expo®, which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. For 27 years, Parasoft has researched and developed software solutions that help organizations deliver defect-free software efficiently. By integrating Development Testing, API/cloud/SOA/composi...
Oct. 31, 2014 05:00 PM EDT Reads: 1,113
The Internet of Things (IoT) promises to evolve the way the world does business; however, understanding how to apply it to your company can be a mystery. Most people struggle with understanding the potential business uses or tend to get caught up in the technology, resulting in solutions that fail to meet even minimum business goals. In his session at Internet of @ThingsExpo, Jesse Shiah, CEO / ...
Oct. 31, 2014 04:00 PM EDT Reads: 1,600