| By Business Wire |
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| December 5, 2012 10:42 AM EST |
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Research and Markets (http://www.researchandmarkets.com/research/42g7rh/design_analysis)
has announced the addition of EJL Wireless Research's new report "Design
Analysis Ericsson W-CDMA/HSPA+ DUW 30 01 Digital Baseband Unit" to their
offering.
This report covers the design analysis of an Ericsson W-CDMA/HSPA+
baseband digital unit. This unit is part of the RBS610x/6201/6301/6601
base station platform for Ericsson W-CDMA. The unit was manufactured in
Q2 2011.
Component and semiconductor suppliers mentioned in this report include:
Analog Devices, Bourns, Broadcom, Coilcraft, Epson-Toyocom, ETAL
Fairchild Semiconductor, Freescale Semiconductor, Hynix, Infineon
Technologies, Integrated Device Technology, Lantiq, lattice
Semiconductor, LSI Logic, Maxim Integrated Products, Micron Technology,
National Semiconductor, Nihon Denpa Kogyo, Nippon Chemi-Con, NXP
Semiconductors, ON Semiconductor, PMC-Sierra, Panasonic, Pulse
Engineering, Rakon, Sanyo Electric, Semtech, Spansion,
STMicroelectronics, TDK-Epcos, Texas Instruments, Vishay Semiconductors
& Xilinx.
Features:
- Complete Part Number/Marking
- Component Manufacturer Identification
- Function Component Description
- Package Type
Total Tables: 8
Total Exhibits: 39
Important Note: There is NO component pricing contained within the
report.
Key Topics Covered:
EXECUTIVE SUMMARY
Active/Passive Component Summary
CHAPTER 1: ERICSSON RBS6000 BTS SYSTEM
Overview of RBS6101/6102/6201/6202/6301/6601 Product Offering
CHAPTER 2: DUW MECHANICAL ANALYSIS
Mechanical Analysis
CHAPTER 3: BASEBAND PROCESSING BOARD SUBSYSTEM
Semiconductor Heat Sinks
CHAPTER 4: BOARD PROCESSOR AND RF/IF INTERFACE BOARD SUBSYSTEM
Semiconductor Heat Sinks
APPENDIX A - PASSIVE CASE SIZE ANALYSIS
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS
For more information visit http://www.researchandmarkets.com/research/42g7rh/design_analysis
Source: EJL Wireless Research
