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SYS-CON MEDIA Authors: Dana Gardner, Elizabeth White, Jnan Dash, Kevin Jackson, Peter Silva

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MagnaChip to Offer Next Generation 0.35um High Voltage BCD Process Technology

SEOUL, South Korea and CUPERTINO, Calif., Jan. 7, 2013 /PRNewswire/ -- MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers a second generation 0.35-micron BCD (Bipolar/CMOS/DMOS) high voltage process technology. This next generation process supports applications from 3.3V to 65V making it ideally suited for DC-DC converters and regulators, Power-over-Ethernet, LED drivers, level shifters, audio amplifiers, AC-DC controllers and converters, micro-converters and micro-inverters, as well as PMICs for the mobile and consumer markets.

(Logo: http://photos.prnewswire.com/prnh/20120305/NY61184LOGO)

This second generation 0.35-micron BCD process features high-voltage MOSFETs with 20~35% lower specific on resistance (Rsp) than the previous generation, achieved through process and device structure optimization. IC designs typically require a broad range of voltage schemes and reliability requirements. This new BCD process features an option to select DMOS devices which best optimize Rsp values for scaled reliability levels. 

Besides featuring a lower Rsp, MagnaChip's proprietary deep-trench isolation technology yields about a five times smaller DMOS isolation area and much improved latch-up immunity, compared to conventional junction isolation approaches. With the combination of lower Rsp, improved isolation and higher reliability, this next generation 0.35-micron BCD process will provide our foundry customers with smaller and higher performance products

This new BCD process technology supports MagnaChip's various process module options which enhance design flexibility and cost effectiveness. These options include multi-time programmable (MTP) and high-reliability non-volatile memory cells, one-time programmable (OTP) cells, high capacitance per unit area, metal-insulator-metal capacitor, copper wire bonding, thick top metal, and redistribution layer process options.

"We are very pleased to offer our next generation 0.35um BCD high voltage process solution optimized for the fast growing mobile and consumer markets," said Namkyu Park, Vice President of Marketing for MagnaChip's foundry division. "As a specialty foundry, our goal is to continue to introduce process technology enhancements for our foundry customers that improve the performance and cost effectiveness of their products."

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

MagnaChip Contacts:


In the United States:

In Korea:

Robert Pursel

Chankeum Park

Director of Investor Relations

Senior Manager, Public Relations

Tel. +1-408-625-1262

Tel. +82-2-6903-3195

[email protected]

[email protected]

SOURCE MagnaChip Semiconductor Corporation

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