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Altis Test & Packaging BU Offers New Ultra High Accuracy Hot & Cold Testing Capability

The Altis Test & Packaging (T&P) Business Unit has recently expanded its capabilities by implementing a new wafer probing system for hot and cold test.

With this new offer, Altis T&P BU is now able to provide wafer test solutions featuring a wide temperature range from -55°C to +200°C and an accuracy of ± 0.1 °C. This solution has been qualified by a first customer for automotive products and is now included in the Altis stand alone test services portfolio.

At wafer test level, this implies the capability to control the temperature setting and distribution all across the wafer very accurately. This can for instance allow multipoint calibration of sophisticated, high-precision advanced mixed signal products to achieve the highest level of performance.

“We are delighted to have been selected by a world wide automotive leader to be a qualified source for the test of some within its most complex products. Accurate test & calibration are absolutely critical to be able to achieve the highest level of analog performances and quality; this new service offered by the T&P BU is key for our customers” says Olivier RICHARD, Altis T&P BU manager.

About Altis Semiconductor

Altis Semiconductor is an independent and privately held company based in France with an industrial campus in Corbeil-Essonnes, a city 40 km south of Paris. The baseline technologies for Altis come from the proven technology platforms of IBM and Infineon, the former shareholders of Altis. With a robust technology portfolio, proven operational excellence and strict quality compliance, Altis is the ideal foundry partner to serve customers in different markets.

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