SYS-CON MEDIA Authors: Elizabeth White, Peter Silva, Liz McMillan, Yeshim Deniz, Pat Romanski

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Freescale Announces Allocations of Proposed New Senior Secured Term Loan Facility

Freescale Semiconductor, Inc. (“Freescale”), a wholly owned subsidiary of Freescale Semiconductor, Ltd. (NYSE:FSL), announced today that Freescale has been advised by the lead arranger under its proposed new senior secured term loan facility that the arrangers have received sufficient orders to allocate and close the proposed new term loan facility. The proposed new term loan facility reduces indebtedness currently due in 2016 and extends to 2020 the maturities of our indebtedness currently due in 2019 and a portion of our indebtedness currently due in 2016. The proposed new term loan facility provides for two term loan tranches in an aggregate principal amount of approximately $2,741,000,000, consisting of a $350,000,000 term loan that will mature in December 2016 and a $2,391,000,000 term loan that will mature in March 2020. The maturity of the 2020 term loan may be accelerated to December 2017 under specified circumstances. The $350,000,000 term loan is expected to bear interest at a rate equal to LIBOR plus 3.25% (with LIBOR of not less than 1.00%), and the $2,391,000,000 term loan is expected to bear interest at a rate equal to LIBOR plus 3.75% (with LIBOR of not less than 1.25%). The closing of the proposed new term loan facility, which is expected to occur on March 1, 2013, is subject to customary conditions, and there can be no assurance that Freescale will be successful in obtaining the proposed new term loan facility on reasonably acceptable terms, or at all.

Cautionary Note Regarding Forward Looking Statements

This press release includes forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 relating to the proposed new term loan facility. Although we believe the assumptions upon which these forward-looking statements are based are reasonable, any of these assumptions could prove to be inaccurate and the forward-looking statements based on these assumptions could be incorrect. The closing of the proposed new term loan facility is subject to customary conditions and involves risks and uncertainties, many of which are outside our control, and any one of which, or a combination of which, could materially affect our ability to enter into the term loan facility described above. Some of these risks and uncertainties include general economic, political and business conditions, uncertainty in the credit markets, unwillingness of lenders to fund commitments associated with the new term loan facility as well as other matters described under "Risk Factors" in our Annual Report on Form 10-K and other filings with the SEC. We undertake no obligation to update any information contained in this press release.

About Freescale Semiconductor

Freescale Semiconductor (NYSE:FSL) is a global leader in embedded processing solutions, providing industry leading products that are advancing the automotive, consumer, industrial and networking markets. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – our technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of our key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices. The company is based in Austin, Texas, and has design, research and development, manufacturing and sales operations around the world. www.freescale.com

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2013.

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