Research and Markets (http://www.researchandmarkets.com/research/5m6rxq/avago_fbar_filter) has announced the addition of the "Avago FBAR Filter All-Silicon MEMS Duplexer Reverse Costing Analysis" report to their offering.

The highest volume production MEMS using TSV Technology based on AlN piezoelectric active layer

With more than 1 Billion units produced per year and a market share of 65%, Avago Technologies clearly dominates the BAW filter market. The ACMD-7612 is an UMTS Duplexer manufactured with Avago's film bulk acoustic resonator (FBAR) technology which uses AlN piezoelectric material for resonating layers.

The filters are hermetically wafer-level packaged with Avago's Microcap bonded-wafer CSP technology, allowing the filters to be assembled in a molded chip-on-board module of less than 1.2 mm high.

TSVs are etched in the cap in order to report electrical contacts and thus reduce filter dies size.

The ACMD-7612 is targeted for handsets or data terminals operating in the UMTS Band I frequency range and features a Maximum RF Input Power to Tx Port of ±33 dBm.

This report provides complete tear-down of the FBAR duplexer with:

- Detailed photos

- Material analysis

- Schematic assembly description

- Manufacturing Process Flow (including AlN process, wafer capping and TSV manufacturing)

- In-depth manufacturing cost analysis

- Supply chain evaluation

- Selling price estimation

Key Topics Covered:

Glossary

Overview/Introduction

Company Profile

Physical Analysis

- Physical Analysis Methodology

- Package Characteristics & Markings

- Package X-Ray

- Package Opening - Main Parts

- Package Cross-Section

- MEMS Dies Dimensions

- MEMS Dies Markings

- MEMS Dies Bond Pads & TSV

- Tx Die Opening

- Tx Die Cap

- Tx Die FBAR

- Rx Die Opening

- MEMS Die Cross-section - Overview

- MEMS Die Cross-section - TSV

- MEMS Die Cross-section - Membrane

- MEMS Die Cross-section - Contacts

Manufacturing Process Flow

- Global Overview

- MEMS Process Overview

- FBAR Process Flow

- Cap Process Flow

- Wafer Bonding Process Flow

- Description of the Wafer Fabrication Unit

- Component Packaging Process Flow

Cost Analysis

- Synthesis of the Cost Analysis

- Main Steps of Economic Analysis

- Yields Explanation

- Yields Hypotheses

- Dies per wafer & Probe Test

- MEMS Front-End Cost

- MEMS Front-End cost per Process Steps

- Back-End 0: Probe Test & Dicing Cost

- MEMS Dies Cost

- Back-End: Packaging Cost

- Back-End: Packaging Cost per steps

- Back-End: Final test Cost

- ACMD-7612 Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis

For more information visit http://www.researchandmarkets.com/research/5m6rxq/avago_fbar_filter.