|By Elizabeth White||
|June 9, 2013 11:00 AM EDT||
Cloud computing continues to gain momentum as enterprises of all sizes and across all industries seek to harness the business agility promised by this computing model. Despite its long-accepted benefits, the cloud has also fallen victim to performance and reliability challenges, combined with a perceived lack of security. As a result this has led to slower predicted growth and adoption of this still promising infrastructure methodology.
In his Lunch Keynote next week at the 12th International Cloud Expo, Neil Cohen, Akamai's Vice President of Global Product Marketing, will discuss how to overcome these challenges, and the role application delivery solutions play in optimizing public and hybrid cloud architectures without sacrificing performance, security or control.
Neil Cohen is Akamai's Vice President of Global Product Marketing where he develops the go-to-market strategy for application performance, site optimization, web security and digital media services. Over the past five years at Akamai, he has brought to market new services and partnerships applied towards strategic enterprise initiatives such as cloud computing, application acceleration, data-center optimization, virtual desktops, mobile web and Internet security. He has over 15 years of engineering, product management and marketing experience in the high-tech industry and a regular speaker and contributor for a variety of cloud computing technology forums and publications.
A Rock Star Faculty, Top Keynotes, Sessions, and Top Delegates!
Cloud Expo 2013 New York, June 10-13, at the Javits Center in New York City, New York, will feature technical sessions from a rock star conference faculty and the leading Cloud industry players in the world.
The growth and success of Cloud Computing will be on display at the upcoming Cloud Expo conference and exhibition in New York City, New York, June 10-13, 2013.
The recent Cloud Expo at the Santa Clara Convention Center in Santa Clara, CA, was the largest Cloud Computing conference ever produced with more sponsors, exhibitors and delegates than all other Cloud events of the year combined!
Cloud Expo New York will attract more than 10,000 delegates from 48 countries and over 200 sponsors and exhibitors!
All main layers of the Cloud ecosystem will be represented at the 12th International Cloud Expo - the infrastructure players, the platform providers, and those offering applications, and they'll all be here to speak, sponsor, exhibit and network.
"Cloud Expo was announced on February 24, 2007, the day the term ‘cloud computing' was coined," said Fuat Kircaali, founder and chairman of SYS-CON Events, Inc. "Cloud has become synonymous with ‘computing' and ‘software' in two short years, and this event has become the new PC Expo, Comdex, and InternetWorld of our decade. By 2013, more than 50,000 delegates per year will be attending Cloud Expo."
for Cloud Expo 2013 New York
Cloud Expo 2013 New York "show prospectus" has shipped. Sponsorship, exhibit, and keynote opportunities can be obtained from Carmen Gonzalez by email at events (at) sys-con.com, or by phone 201 802-3021.
About SYS-CON Media & Events
SYS-CON Media (www.sys-con.com) has since 1994 been connecting technology companies and customers through a comprehensive content stream at www.sys-con.com - featuring over forty focused subject areas, from Cloud Computing to Web Security - interwoven with market-leading full-scale conferences produced by SYS-CON Events. The company's internationally recognized brands include among others Cloud Expo (www.CloudComputingExpo.com), Big Data Expo (http://BigDataExpo.net), SDN Expo (http://sdnexpo.co),Virtualization Conference & Expo (www.VirtualizationConference.com), Government IT Conference & Expo (www.GovITExpo.com), Cloud Computing Bootcamp (www.CloudComputingBootcamp.com), and UlitzerLive! New Media Conference & Expo (http://events.sys-con.com).
Cloud Expo, Cloud Expo East, Cloud Expo West, Cloud Expo New York, Cloud Expo Silicon Valley, Cloud Expo Europe, Cloud Expo Tokyo, Cloud Expo Prague, Cloud Expo Hong Kong, Cloud Expo Sao Paolo are trademarks and /or registered trademarks (USPTO serial number 85009040) of Cloud Expo, Inc.