|By Business Wire||
|January 7, 2014 07:05 AM EST||
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), will display its latest xFDTM products solutions at CES Las Vegas, Jan. 7 - 10, 2014, including cloud server module solutions featuring advanced Registered Dual Inline Memory Modules (R-DIMMs) in collaboration with semiconductor manufacturer, Etron Technology, Inc., and memory module provider, ADATA Technology.
“Invensas xFD technology plays a vital role in minimizing manufacturing cost, while enhancing electrical and thermal performance versus conventional technology,” said Dr. James Sung, president of Etron Technology. “We see significant pull from semiconductor users with Invensas xFD technology.”
xFD technology connects multiple memory chips in a face-down shingle-stack configuration using ultra-short wirebonds. The solution significantly reduces the cost of server and datacenter operation by providing superior data access performance with significantly lower cooling costs and power usage.
“We are delighted to be at CES with Etron and ADATA,” said Simon McElrea, president of Invensas Corporation. “Semiconductor packaging, or Interconnectology as we call it at Invensas, is growing to become a vital and highly valuable element of the mobile and cloud storage landscape. Our intellectual property and technology solutions continue to gain traction with key customers and supply chain partners in this exciting space.”
Invensas will display the products with Etron Technology, Inc. in Etron’s Booth #35116 LVCC, South Hall 4, Las Vegas, NV, on Jan. 7 - 10, 2014. More details and additional Invensas xFD solutions can be found at www.invensas.com.
Safe Harbor Statement
This document contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to Invensas’s participation at CES Las Vegas and the characteristics, features, benefits and market adoption of Invensas’s intellectual property and technology, including xFD. Material factors that may cause results to differ from the statements made include the plans or operations relating to the businesses of Tessera Technologies, Inc. (the “Company”); market or industry conditions; changes in patent laws, regulation or enforcement, or other factors that might affect the Company's ability to protect or realize the value of its intellectual property; the expiration of license agreements and the cessation of related royalty income; the failure, inability or refusal of licensees to pay royalties; initiation, delays, setbacks or losses relating to the Company's intellectual property or intellectual property litigations, or invalidation or limitation of key patents; the timing and results, which are not predictable and may vary in any individual proceeding, of any ICC ruling or award, including in the Amkor arbitration; fluctuations in operating results due to the timing of new license agreements and royalties, or due to legal costs; the risk of a decline in demand for semiconductor and camera module products; failure by the industry to use technologies covered by the Company's patents; the expiration of the Company's patents; the Company's ability to successfully complete and integrate acquisitions of businesses; the risk of loss of, or decreases in production orders from, customers of acquired businesses; financial and regulatory risks associated with the international nature of the Company's businesses; failure of the Company's products to achieve technological feasibility or profitability; failure to successfully commercialize the Company's products; changes in demand for the products of the Company's customers; limited opportunities to license technologies and sell products due to high concentration in the markets for semiconductors and related products and camera modules; the impact of competing technologies on the demand for the Company's technologies and products; and the reliance on a limited number of suppliers for the components used in the manufacture of DOC products. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. The Company's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended Dec. 31, 2012, and its Quarterly Report on Form 10-Q for the quarter ended Sept. 30, 2013, include more information about factors that could affect the Company's financial results. The Company assumes no obligation to update information contained in this press release. Although this release may remain available on the Company's website or elsewhere, its continued availability does not indicate that the Company is reaffirming or confirming any of the information contained herein.
About Etron Technology, Inc.
Etron Technology, Inc. (Taiwan GTSM: 5351) is a world-class fabless integrated circuits design and product company founded in 1991 and specializing in semiconductor memories and system chips. In Taiwan’s “National Sub-micron Project” from the early 1990s, Etron participated in architecting, pioneering, and developing Taiwan’s first 8-inch sub-micron wafer, thus establishing a solid foundation for the fabless, foundry, SRAM, and DRAM industries which have transformed Taiwan into a major semiconductor powerhouse. As a publicly traded company headquartered in Taiwan and focused on bridging the Asia-Pacific and the global markets, Etron is producing a variety of IC products, including buffer memories, USB3.0 host controllers and flash memory controllers, USB power delivery controllers, gesture control ICs, and others.www.etron.com
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA - News), is a global leader in semiconductor interconnect solutions and intellectual property. Invensas innovates in areas such as mobile computing and communications, memory and data storage, and 3-D Integrated Circuit (3DIC) technologies. Headquartered in San Jose, California, Invensas licenses these solutions to Original Equipment Makers, Original Design Manufacturers, and Integrated Device Manufactures and delivers the products to market through collaborative engineering partnerships and strategic business alliances. Learn more at www.interconnectology.com or www.invensas.com, or contact Invensas PR at +1 408 324 5105.
The 4th International DevOps Summit, co-located with16th International Cloud Expo – being held June 9-11, 2015, at the Javits Center in New York City, NY – announces that its Call for Papers is now open. Born out of proven success in agile development, cloud computing, and process automation, DevOps is a macro trend you cannot afford to miss. From showcase success stories from early adopters and ...
Oct. 31, 2014 02:15 AM EDT Reads: 1,983
We live in a time when seconds – even milliseconds – can have a dramatic economic impact on your company’s future. With technology being the primary conduit for consumer interaction, the user experience is at center stage. User experience will be a deciding factor in separating the future winners from the losers. By building more speed and agility into the application delivery process, DevOps prom...
Oct. 31, 2014 02:00 AM EDT Reads: 1,085
When an enterprise builds a hybrid IaaS cloud connecting its data center to one or more public clouds, security is often a major topic along with the other challenges involved. Security is closely intertwined with the networking choices made for the hybrid cloud. Traditional networking approaches for building a hybrid cloud try to kludge together the enterprise infrastructure with the public clou...
Oct. 30, 2014 07:00 PM EDT Reads: 1,517
Ixia develops amazing products so its customers can connect the world. Ixia helps its customers provide an always-on user experience through fast, secure delivery of dynamic connected technologies and services. Through actionable insights that accelerate and secure application and service delivery, Ixia's customers benefit from faster time to market, optimized application performance and higher-qu...
Oct. 30, 2014 07:00 PM EDT Reads: 1,827
SYS-CON Events announced today that Stratogent will exhibit at SYS-CON's 15th International Cloud Expo®, which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. Stratogent is a custom managed services organization based in San Mateo, California. We design, implement, and support mission critical infrastructure 24x7 on premises, in datacenters and in t...
Oct. 30, 2014 06:45 PM EDT Reads: 2,136
SYS-CON Events announced today that Grid Dynamics, the leading provider of scalable eCommerce technology solutions, will exhibit at DevOps Summit Silicon Valley, which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. Grid Dynamics is a leading provider of open, scalable, next-generation commerce technology solutions for Tier 1 retail. Grid Dynamics h...
Oct. 30, 2014 06:00 PM EDT Reads: 1,124
SYS-CON Events announced today that Harbinger Systems will exhibit at SYS-CON's 15th International Cloud Expo®, which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. Harbinger Systems is a global company providing software technology services. Since 1990, Harbinger has developed a strong customer base worldwide. Its customers include software product...
Oct. 30, 2014 06:00 PM EDT Reads: 3,148
SYS-CON Events announces a new pavilion on the Cloud Expo floor where WebRTC converges with the Internet of Things. Pavilion will showcase WebRTC and the Internet of Things. The Internet of Things (IoT) is the most profound change in personal and enterprise IT since the creation of the Worldwide Web more than 20 years ago. All major researchers estimate there will be tens of billions devices--co...
Oct. 30, 2014 05:30 PM EDT Reads: 2,167
The only place to be June 9-11 is Cloud Expo & @ThingsExpo 2015 East at the Javits Center in New York City. Join us there as delegates from all over the world come to listen to and engage with speakers & sponsors from the leading Cloud Computing, IoT & Big Data companies. Cloud Expo & @ThingsExpo are the leading events covering the booming market of Cloud Computing, IoT & Big Data for the enterp...
Oct. 30, 2014 05:30 PM EDT Reads: 1,183
Docker offers a new, lightweight approach to application portability. Applications are shipped using a common container format and managed with a high-level API. Their processes run within isolated namespaces that abstract the operating environment independently of the distribution, versions, network setup, and other details of this environment. This "containerization" has often been nicknamed "th...
Oct. 30, 2014 05:00 PM EDT Reads: 1,781