|By ACN Newswire||
|January 7, 2014 10:13 PM EST||
Mechanical strength is approx. 80% higher than the existing product, maintaining strength at high temperatures, supporting high heat resistance demand for power devices
|Appearance of TALF|
In addition to mechanical strength being approximately 80% higher than the existing product, TALF can contribute to an increase in the heat resistance temperature of packages because of its recrystallization temperature 50 degrees Celsius higher than the existing product. Furthermore, although the existing product hardened and recrystallized in 30 minutes in the high-temperature shelf test (300 degrees Celsius) after bonding, resulting in shear strength decreasing by approximately 10%, TALF is not subject to a decrease in shear strength because recrystallization does not commence. Because of this, shear strength can maintain even at high temperatures.
Normally, bonding wire can prevent damage from thermal fatigue when mechanical strength is raised by hardening the material, but this simultaneously damages IC chip easily during bonding. TALF is an alloy containing 99% aluminum, and by optimizing the processing method using finer particles of aluminum crystals, the company succeeded in providing high strength and high heat resistance without damaging the chip.
Aluminum bonding wire is currently used as material for large-current semiconductors such as power devices. In recent years, there have been demands for development of high heat resistant materials as power devices have higher density, become more compact and have higher output, TALF can contribute to improve heat resistance temperature of packages. The features of TALF are as follows.
- High mechanical strength
TALF has improved mechanical strength by approximately 80% by optimizing the processing method using finer particles of aluminum crystals. The hardness of the cross-section of the wire contact after bonding is almost the same as the existing product, and does not damage the chip during bonding. This is due to an optimized material composition.
* Comparison of Vickers hardness (Hv) ---------------------------------------------------------------------- TALF Existing product ---------------------------------------------------------------------- Wire cross-section Hv 25.1 20.0 Contact cross-section Hv 35.0 34.8 ----------------------------------------------------------------------- High thermal fatigue strength
In addition to mechanical strength being approximately 80% higher than the existing product, whereas the existing product has reduced shear strength due to early recrystallization in high-temperature shelf tests, TALF does not have reduced shear strength because it does not recrystallize due to the recrystallization temperature by 50 degrees Celsius and higher. This contributes to higher thermal resistance of power devices as the wire is able to suppress thermal fatigue damage in power cycle tests(*1) and thermal cycle tests(*2).
- Provides other excellent performances
The bonding properties are the same as the existing product, enabling bonding under identical conditions. In addition, the corrosion resistance is the same as the existing product, and the wire has been confirmed no corrosion even after 1,000 hours in a pressure cooker test (PCT). Furthermore, despite having 99% purity, the specific resistance is almost the same as the existing product at 2.8 micro-ohm centimeters.
Tanaka Denshi Kogyo has a leading share in the global market for aluminum bonding wire, and has provided the existing product, TANW since 1988. TALF is the first new aluminum bonding wire product in 26 years. Tanaka Denshi Kogyo aims for TALF sales of 100 million yen per month in 3 years through the replacement of the existing product and the development of new demands.
Tanaka Denshi Kogyo has scheduled to exhibit TALF at the 15th IC Packaging Technology Expo to be held at Tokyo Big Sight (Koto-ku, Tokyo) for three days from January 15 (Wed) until January 17 (Fri). Technical staff will constantly be on-site in the exhibit booth (East 43-001) to respond to interviews.
Press release: http://www.acnnewswire.com/clientreports/598/0108_EN.pdf
(*1) Power Cycle Test: A test for evaluating the durability to thermal stress by raising and lowering chip temperature through repeated ON/OFF operation of power semiconductors.
(*2) Thermal cycle test: A test for evaluating the durability of materials to changes in temperature through repeated exposure of samples to high temperature and low temperature environments.
Tanaka Holdings Co., Ltd. (Holding company of Tanaka Precious Metals)
Headquarters: 22F, Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Hideya Okamoto, President & CEO
Capital: 500 million yen
Employees in consolidated group: 3,895 (FY2012)
Net sales of consolidated group: 839.2 billion yen (FY2012)
Main businesses of the group: Manufacture, sales, import and export of precious metals (platinum, gold, silver, and others) and various types of industrial precious metals products. Recycling and refining of precious metals.
Website: http://www.tanaka.co.jp/english (Tanaka Precious Metals), http://pro.tanaka.co.jp/en (Industrial products)
Tanaka Denshi Kogyo K.K.
Head office: 22F Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Koichiro Tanaka, President & CEO
Capital: 1,880 million yen
Employees: 151 (FY2012)
Net sales: 32,323 million yen (FY2012)
Businesses: Manufacture of high-purity bonding wire (gold, gold alloy, aluminum, aluminum-silicon, copper, etc.)
About the Tanaka Precious Metals
Established in 1885, the Tanaka Precious Metals has built a diversified range of business activities focused on the use of precious metals. On April 1, 2010, the group was reorganized with Tanaka Holdings Co., Ltd. as the holding company (parent company) of the Tanaka Precious Metals. In addition to strengthening corporate governance, the company aims to improve overall service to customers by ensuring efficient management and dynamic execution of operations. Tanaka Precious Metals is committed, as a specialist corporate entity, to providing a diverse range of products through cooperation among group companies.
Tanaka Precious Metals is in the top class in Japan in terms of the volume of precious metal handled, and for many years the group has developed and stably supplied industrial precious metals, in addition to providing accessories and savings commodities utilizing precious metals. As precious metal professionals, the Group will continue to contribute to enriching people's lives in the future.
The eight core companies in the Tanaka Precious Metals are as follows.
- Tanaka Holdings Co., Ltd. (pure holding company)
- Tanaka Kikinzoku Kogyo K.K.
- Tanaka Kikinzoku Hanbai K.K.
- Tanaka Kikinzoku International K.K.
- Tanaka Denshi Kogyo K.K.
- Electroplating Engineers of Japan, Limited
- Tanaka Kikinzoku Jewelry K.K.
- Tanaka Kikinzoku Business Service K.K.
Global Sales Dept., Tanaka Kikinzoku International K.K. (TKI)
Source: Tanaka Holdings Co., Ltd.
Copyright 2014 ACN Newswire. All rights reserved.
SYS-CON Events announced today that Windstream, a leading provider of advanced network and cloud communications, has been named “Silver Sponsor” of SYS-CON's 16th International Cloud Expo®, which will take place on June 9–11, 2015, at the Javits Center in New York, NY. Windstream (Nasdaq: WIN), a FORTUNE 500 and S&P 500 company, is a leading provider of advanced network communications, including cloud computing and managed services, to businesses nationwide. The company also offers broadband, p...
Nov. 23, 2014 06:30 PM EST Reads: 1,597
The 4th International DevOps Summit, co-located with16th International Cloud Expo – being held June 9-11, 2015, at the Javits Center in New York City, NY – announces that its Call for Papers is now open. Born out of proven success in agile development, cloud computing, and process automation, DevOps is a macro trend you cannot afford to miss. From showcase success stories from early adopters and web-scale businesses, DevOps is expanding to organizations of all sizes, including the world's large...
Nov. 23, 2014 12:30 PM EST Reads: 1,295
"There is a natural synchronization between the business models, the IoT is there to support ,” explained Brendan O'Brien, Co-founder and Chief Architect of Aria Systems, in this SYS-CON.tv interview at the 15th International Cloud Expo®, held Nov 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA.
Nov. 23, 2014 12:00 PM EST Reads: 1,573
Verizon Enterprise Solutions is simplifying the cloud-purchasing experience for its clients, with the launch of Verizon Cloud Marketplace, a key foundational component of the company's robust ecosystem of enterprise-class technologies. The online storefront will initially feature pre-built cloud-based services from AppDynamics, Hitachi Data Systems, Juniper Networks, PfSense and Tervela. Available globally to enterprises using Verizon Cloud, Verizon Cloud Marketplace provides a one-stop shop fo...
Nov. 23, 2014 11:00 AM EST Reads: 1,261
Leysin American School is an exclusive, private boarding school located in Leysin, Switzerland. Leysin selected an OpenStack-powered, private cloud as a service to manage multiple applications and provide development environments for students across the institution. Seeking to meet rigid data sovereignty and data integrity requirements while offering flexible, on-demand cloud resources to users, Leysin identified OpenStack as the clear choice to round out the school's cloud strategy. Additional...
Nov. 23, 2014 08:00 AM EST Reads: 1,381
The major cloud platforms defy a simple, side-by-side analysis. Each of the major IaaS public-cloud platforms offers their own unique strengths and functionality. Options for on-site private cloud are diverse as well, and must be designed and deployed while taking existing legacy architecture and infrastructure into account. Then the reality is that most enterprises are embarking on a hybrid cloud strategy and programs. In this Power Panel at 15th Cloud Expo (http://www.CloudComputingExpo.com...
Nov. 23, 2014 07:45 AM EST Reads: 1,423
We are all here because we are sold on the transformative promise of The Cloud. But what good is all of this ephemeral, on-demand infrastructure if your usage doesn't actually improve the agility and speed of your business? How must Operations adapt in order to avoid stifling your Cloud initiative? In his session at DevOps Summit, Damon Edwards, co-founder and managing partner of the DTO Solutions, will highlight the successful organizational, process, and tooling patterns of high-performing c...
Nov. 23, 2014 02:00 AM EST Reads: 1,162
The definition of IoT is not new, in fact it’s been around for over a decade. What has changed is the public's awareness that the technology we use on a daily basis has caught up on the vision of an always on, always connected world. If you look into the details of what comprises the IoT, you’ll see that it includes everything from cloud computing, Big Data analytics, “Things,” Web communication, applications, network, storage, etc. It is essentially including everything connected online from ha...
Nov. 22, 2014 10:00 PM EST Reads: 1,270
Software-driven innovation is becoming a primary approach to how businesses create and deliver new value to customers. A survey of 400 business and IT executives by the IBM Institute for Business Value showed businesses that are more effective at software delivery are also more profitable than their peers nearly 70 percent of the time (1). DevOps provides a way for businesses to remain competitive, applying lean and agile principles to software development to speed the delivery of software that ...
Nov. 22, 2014 08:00 PM EST Reads: 1,501
Docker offers a new, lightweight approach to application portability. Applications are shipped using a common container format and managed with a high-level API. Their processes run within isolated namespaces that abstract the operating environment independently of the distribution, versions, network setup, and other details of this environment. This "containerization" has often been nicknamed "the new virtualization." But containers are more than lightweight virtual machines. Beyond their small...
Nov. 22, 2014 06:45 PM EST Reads: 1,282
The move in recent years to cloud computing services and architectures has added significant pace to the application development and deployment environment. When enterprise IT can spin up large computing instances in just minutes, developers can also design and deploy in small time frames that were unimaginable a few years ago. The consequent move toward lean, agile, and fast development leads to the need for the development and operations sides to work very closely together. Thus, DevOps become...
Nov. 22, 2014 05:45 PM EST Reads: 1,409
ARMONK, N.Y., Nov. 20, 2014 /PRNewswire/ -- IBM (NYSE: IBM) today announced that it is bringing a greater level of control, security and flexibility to cloud-based application development and delivery with a single-tenant version of Bluemix, IBM's
An entirely new security model is needed for the Internet of Things, or is it? Can we save some old and tested controls for this new and different environment? In his session at @ThingsExpo, New York's at the Javits Center, Davi Ottenheimer, EMC Senior Director of Trust, reviewed hands-on lessons with IoT devices and reveal a new risk balance you might not expect. Davi Ottenheimer, EMC Senior Director of Trust, has more than nineteen years' experience managing global security operations and asse...
Nov. 22, 2014 05:30 PM EST Reads: 1,231
Explosive growth in connected devices. Enormous amounts of data for collection and analysis. Critical use of data for split-second decision making and actionable information. All three are factors in making the Internet of Things a reality. Yet, any one factor would have an IT organization pondering its infrastructure strategy. How should your organization enhance its IT framework to enable an Internet of Things implementation? In his session at Internet of @ThingsExpo, James Kirkland, Chief Ar...
Nov. 21, 2014 09:15 PM EST Reads: 1,320