|By Business Wire||
|January 20, 2014 05:20 AM EST||
Research and Markets (http://www.researchandmarkets.com/research/ttlpzx/opportunities_in) has announced the addition of the "Opportunities in the Supply Chain for High-Speed Electronics, 2012-2018" report to their offering.
A Strategic Review of PCB, Material and Interconnect on Trends and Needs for Electronic Assemblies for High-Speed Telecom, Datacom Networks and High-End Computers Over the Period 2012 to 2018.
The 2013 edition of this report as before explores the implications for the next generation of high speed electronic architectures and the supply chain as data rates shift up.
In network infrastructure, systems supporting 100G Ethernet are emerging and serial transmission rates are more than doubling from 10Gbps to >20Gbps. The next generation of standards will tackle 400G and the solutions for this will require 40-50Gbps serial data. These and high performance computing requirements, will be the factors which will drive more widespread adoption of optical backplanes and silicon photonics when signal integrity, interconnect density and thermal management budgets cannot be realised with printed circuit boards.
In the wireless communication sector, the introduction and advancement of 4G technology will have implications for base station and transceiver design. New generations of eNodeB base stations are more compact in size, more intelligent and more flexible in performance as base station controllers are no longer required and an access network comprises several base stations connected to each other and directly accessing a gateway to the backbone network.
These and other applications are considered in the new High Speed Report which includes technology roadmaps for high performance system architectures, a detailed looked at the high performance laminates which are available for the next generation of systems, and forecast of PCB and laminate demand out to 2018.
Reasons To Buy
- This study provides a totally integrated assessment of the high speed electronics value chain
- Identification and quantification of the opportunities for small, medium and large technology vendors
- Comprehensive roadmaps detailing the technologies, materials and processes that will be needed to participate in these markets
- Identifies key technology and market drivers of this major market sector
Key Topics Covered
- High-Speed System Architecture And Market Drivers
- High-Speed Substrates
- Advanced Semiconductor Packaging
- Optical Interconnect
- Market Forecasts
- Conclusion & Opportunities
For more information visit http://www.researchandmarkets.com/research/ttlpzx/opportunities_in
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