Click here to close now.

SYS-CON MEDIA Authors: Liz McMillan, Pat Romanski, Carmen Gonzalez, Kevin Jackson, Peter Silva

News Feed Item

Analysis of the Global Semiconductors in Thin Film and Printed Battery Market

NEW YORK, Jan. 20, 2014 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

Analysis of the Global Semiconductors in Thin Film and Printed Battery Market 
http://www.reportlinker.com/p01941681/Analysis-of-the-Global-Semiconductors-in-Thin-Film-and-Printed-Battery-Market .html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electronic_Component_and_Semiconductor

Low-power Microcontrollers to be the Largest Sub-segment by 2020

Executive Summary

- Thin film and printed battery (TFB) technology is relatively nascent and is being used to evaluate potential opportunities in several different applications.
- Most applications are in the pilot stage of development, with approximately a few hundred thousand in unit shipments. In turn, the volume of units shipped is limited for both semiconductors and TFB applications.
- The popular battery form factor used in most devices is coin cell, and the market for semiconductors in these types of devices is quite strong. The shift from coin cell to a flexible or a printed battery, however, is delayed by a number of factors—initial high pricing remains one of the most important.
- This study discusses the drivers and restraints, revenue, and Mega Trends for semiconductors in the TFB market, across North America; Europe; and Asia-Pacific and the Rest of World (ROW).

CEO's Perspective

- Partnerships between semiconductor companies, research institutions, material developers, or equipment suppliers will help optimize the cost against the value curve.
- The healthcare devices market will be a major driver for growth from 2013–2016.
- Asia-Pacific and the ROW provide great scope for growth in low-power semiconductors over the forecast period.
- Price issues and manufacturing challenges associated with TFB technology are amongst the major factors limiting high-volume shipment of semiconductors in TFB applications.
- Economies of scale in this market are expected towards the end of 2016, after which volume production and shipment will be high.

Markett Overview—Definitions

- This study aims to track the semiconductors used in TFB applications/devices. The type of TFB applications or devices considered for this study are the following:
oRadio frequency identification device (RFID) tags
oRF enabled sensors
oMedical devices
oTransdermal patches
oAccess tokens
oPowered smart cards/credit cards

- The semiconductor components typically used in these kinds of devices are the following:
oUltra-low-power microcontrollers
oTimer circuits
oBluetooth low-energy chips
oNear-field communication (NFC)chips
oSensors

Key Questions This Study Will Answer

- What is the current market scenario? Is the market growing? How long will it continue to grow and at what rate?
- In what stage is this market? Will these products continue to be in demand, or will they be replaced by other lower-end products?
- How will the structure of the market change over time? Is the market ripe for acquisitions?
- Are the products/services offered today meeting customer needs, or is additional development needed?
Executive Summary
Market Overview
Total Semiconductors in Thin Film and Printed Battery Market
- External Challenges: Drivers and Restraints
- Forecasts and Trends
- Competitive Analysis
- Mega Trends and Industry Convergence Implications
The Last Word
Appendix

To order this report: Analysis of the Global Semiconductors in Thin Film and Printed Battery Market 
http://www.reportlinker.com/p01941681/Analysis-of-the-Global-Semiconductors-in-Thin-Film-and-Printed-Battery-Market .html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electronic_Component_and_Semiconductor

__________________________
Contact Clare: [email protected]
US: (339)-368-6001
Intl: +1 339-368-6001

SOURCE Reportlinker

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
SYS-CON Events announced today that Cisco, the worldwide leader in IT that transforms how people connect, communicate and collaborate, has been named “Gold Sponsor” of SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. Cisco makes amazing things happen by connecting the unconnected. Cisco has shaped the future of the Internet by becoming the worldwide leader in transforming how people connect, communicate and collaborat...
Chuck Piluso will present a study of cloud adoption trends and the power and flexibility of IBM Power and Pureflex cloud solutions. Speaker Bio: Prior to Data Storage Corporation (DSC), Mr. Piluso founded North American Telecommunication Corporation, a facilities-based Competitive Local Exchange Carrier licensed by the Public Service Commission in 10 states, serving as the company's chairman and president from 1997 to 2000. Between 1990 and 1997, Mr. Piluso served as chairman & founder of ...
SYS-CON Events announced today that Liaison Technologies, a leading provider of data management and integration cloud services and solutions, has been named "Silver Sponsor" of SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York, NY. Liaison Technologies is a recognized market leader in providing cloud-enabled data integration and data management solutions to break down complex information barriers, enabling enterprises to make sm...
Participants will reach the final if their IoT solution is liked. A community vote will determine the best solutions submitted in each country, after which an expert jury will select the national winners and the best international IoT solution. Each country's best solution can win a national marketing campaign worth up to €30,000 and become a partner in Deutsche Telekom's participating markets. The winning international solution can become partner of Deutsche Telekom Group across all eight coun...
Recent technology advances in miniaturization has positioned the wearables as the pinnacle of technology convergence with the human body. We inquire if wearables are mere standard miniaturized devices extended with the connectivity and present our views on considerations like design, applications, performance, efficiency, interoperability, usage scenarios, human device interaction and consequent trade-offs enabling wearables to impart optimal value.
In this session we look at creating interactive communications via the web by adding messaging, file transfer, and group communication (group chat and audio/video conferencing) into the web experience. We will also discuss potential applications of this technology in areas including B2B, B2C, P2P, and gaming. Peter is Technical Director at Acision. He graduated from The University of Edinburgh in 2000 with a BSc (Hons) in Computer Science. After graduation Peter worked on a PSTN switch dev...
SYS-CON Events announced today that Windstream, a leading provider of advanced network and cloud communications, has been named “Silver Sponsor” of SYS-CON's 16th International Cloud Expo®, which will take place on June 9–11, 2015, at the Javits Center in New York, NY. Windstream (Nasdaq: WIN), a FORTUNE 500 and S&P 500 company, is a leading provider of advanced network communications, including cloud computing and managed services, to businesses nationwide. The company also offers broadband, p...
SYS-CON Events announced today that SoftLayer, an IBM company, has been named “Gold Sponsor” of SYS-CON's 16th International Cloud Expo®, which will take place June 9-11, 2015 at the Javits Center in New York City, NY, and the 17th International Cloud Expo®, which will take place November 3–5, 2015 at the Santa Clara Convention Center in Santa Clara, CA. SoftLayer operates a global cloud infrastructure platform built for Internet scale. With a global footprint of data centers and network points...
WebRTC Summit has announced today that Peter Dunkley has been named summit chair of WebRTC Summit 2015 New York. The 4th International WebRTC Summit will take place on June 9-11, 2015, at the Javits Center in Manhattan, New York. @ThingsExpo anticipates 90% of WebRTC companies & developers will monetize their products & services through IoT by 2016. Peter Dunkley is Technical Director at Acision. He graduated from The University of Edinburgh in 2000 with a BSc (Hons) in Computer Science...
SYS-CON Events announced today that Stratoscale, the new data center operating system, will exhibit at SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. Based in Herzeliya, Israel, Stratoscale is redefining the data center, developing a hardware-agnostic, software platform hyper-converging compute, storage and networking across the rack or data center. The self-optimizing platform automatically distributes all physical...
The WebRTC Summit 2015 New York, to be held June 9-11, 2015, at the Javits Center in New York, NY, announces that its Call for Papers is open. Topics include all aspects of improving IT delivery by eliminating waste through automated business models leveraging cloud technologies. WebRTC Summit is co-located with 16th International Cloud Expo, @ThingsExpo, Big Data Expo, and DevOps Summit.
SYS-CON Events announced today that ProfitBricks, the provider of painless cloud infrastructure, will exhibit at SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY., and the 17th International Cloud Expo®, which will take place on November 3–5, 2015, at the Santa Clara Convention Center in Santa Clara, CA. ProfitBricks is the IaaS provider that offers a painless cloud experience for all IT users, with no learning curve. ...
SYS-CON Events announced today that Emcien will exhibit at SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. Emcien’s vision is to let anyone use data to know the future. Emcien has built an automated, predictive analysis product that improves the lives of real people. Emcien allows people to automate their data analysis so they can build a better future.
SYS-CON Events announced today that Dyn, the worldwide leader in Internet Performance, will exhibit at SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. Dyn is a cloud-based Internet Performance company. Dyn helps companies monitor, control, and optimize online infrastructure for an exceptional end-user experience. Through a world-class network and unrivaled, objective intelligence into Internet conditions, Dyn ensures...
SYS-CON Events announced today that Open Data Centers (ODC), a carrier-neutral colocation provider, will exhibit at SYS-CON's 16th International Cloud Expo®, which will take place June 9-11, 2015, at the Javits Center in New York City, NY. Open Data Centers is a carrier-neutral data center operator in New Jersey and New York City offering alternative connectivity options for carriers, service providers and enterprise customers.