SYS-CON MEDIA Authors: Greg Smith, Kevin Benedict, Gilad Parann-Nissany, Michael Bushong, Eric Brown

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Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013 to 2020 Vol II: On-Chip and Chip-to-Chip

DUBLIN, January 27, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/cflft4/revenue) has announced the addition of the "Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013 to 2020 Vol II: On-Chip and Chip-to-Chip" report to their offering. 

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

The traditional architectural and material assumptions with regard to how integrated circuits are fabricated have been challenged in recent years and the semiconductor industry is looking for new solutions. Power and thermal issues add to this apparent crisis in the semiconductor industry.

One of the most important problems is the so-called interconnect bottleneck, that is the tendency for data traffic jams to appear both on-chip and chip-to-chip. The interconnect bottleneck is emerging well before Moore's Law completely runs out of steam, but reappears in differing forms in some of the new architectures designed to make chip scaling easier.

The obvious solution is to deploy fiber optics; which is usually the way to go whenever and wherever there is a bandwidth problem. But fiber optic solutions to on-chip and chip-to-chip interconnection is something that will be hard to develop for commercial chip products. Producing photonic devices that are small enough and inexpensive enough to be used at the chip level is an immensely difficult requirement.

In this report, we analyze the latest developments in optical interconnection at the chip level and the progress in this area that is being made by important research teams throughout the world. Both R&D and commercial development are discussed.


Key Topics Covered: 

Executive Summary 

Chapter One: Introduction 
1.1 Background to this Report
1.2 Objectives of this Report
1.3 Methodology and Information Sources for this Report

Chapter Two: Analysis of Demand for On-Chip/Chip-to-Chip Interconnection 
2.1 Megatrends Driving the Need for Optical Interconnect at All Levels
2.2 Chip-to-Chip and On-Chip Interconnect: Replacing Copper
2.3 Limits to Electronic Interconnects
2.4 Drivers and Threats for Optical Interconnect
2.5 Moore's Law, Scaling and Interconnect
2.6 Multicore Processing and Interconnect
2.7 3D Chips and Interconnect
2.8 A Possible Transition to Optical Computing and Communications: Interconnect Implications
2.9 Potential for Moving to Nanocarbon Computers
2.10 Key Points Made in this Chapter

Chapter Three: Technologies for On-Chip/Chip-to-Chip Interconnect 
3.1 Future Technologies for Chip-Level Interconnect
3.2 VCSELs for Interconnect: Getting Faster
3.3 Silicon Lasers
3.4 Quantum Dot Lasers
3.5 Optical Engines
3.6 The Role of Optical Integration in Future Chip-Based Interconnection
3.7 Silicon Photonics
3.8 Opportunities for Fiber, Waveguides and Free-Space Optics in Chip-Level Interconnect
3.9 Use of Carbon Nanotubes and Graphene for Chip-Level Optical Interconnect
3.10 Key Points Made in this Chapter



Companies Mentioned:

  • Avago
  • Cisco
  • Corning
  • Dow Chemical
  • Dow-Corning
  • DuPont
  • Finisar
  • Fujitsu
  • Furukawa
  • IBM
  • Intel
  • Juniper
  • Kotura
  • Micron
  • Novellus
  • Optical Interlinks
  • QD Laser
  • Reflex Photonics
  • Samtec
  • Sumitomo
  • TeraXion
  • Tokyo Electron
  • ULM Photonics
  • VI Systems



For more information visit http://www.researchandmarkets.com/research/cflft4/revenue


Media Contact: Laura Wood , +353-1-481-1716, [email protected]


SOURCE Research and Markets

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