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Silicon Labs Si504 - CMEMS Oscillator Reverse Costing Analysis

DUBLIN, February 6, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/fpj6dd/silicon_labs) has announced the addition of the "Silicon Labs Si504 - CMEMS Oscillator Reverse Costing Analysis" report to their offering.

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )


First Fully Integrated, Monolithic Cmos+Mems Oscillator Device

The frequency control market is largely dominated by quartz products, but silicon timing solutions have a strong value proposition for some sub-markets.

The Si504 is the first silicon oscillator from Silicon Labs. Manufactured with the CMEMS process (CMOS + MEMS), the crystal elements are replaced by micromachined semiconductor resonators.

CMEMS process consists in a monolithic integration of a CMOS circuit with Poly-SiGe (polycrystalline silicon-germanium) MEMS resonator structures.

The resonator is then vacuum encapsulated with a silicon cap using an eutectic wafer bonding process.

The Si504 is optimized to support high-volume, low-cost applications such as consumer electronics market.

This report will provide a complete teardown of the MEMS oscillator with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth manufacturing cost analysis
  • Supply chain evaluation
  • Selling price estimation


Key Topics Covered:

Glossary

Overview/Introduction

  • Executive Summary
  • Reverse Costing Methodology

Silicon Labs Company Profile

  • Silicon Labs Profile
  • Si504 Characteristics

Physical Analysis

  • Silicon Labs Si504
  • CMEMS Oscillator
  • Physical Analysis Methodology
  • Package
  • Package View, Dimensions & Pinout
  • Package XRay
  • Package Opening
  • Package CrossSection
  • Die
  • View, Dimensions & Marking
  • MEMS Cap Removed
  • MEMS Cap Details
  • MEMS Resonator Structure
  • CMEMS Delayering & IC Process
  • MEMS Cap CrossSection
  • CMEMS CrossSection
  • IC Layers
  • MEMS Layers

Manufacturing Process Flow

  • Global Overview
  • CMOS FrontEnd Process
  • MEMS Resonator Process Flow
  • MEMS Cap & Assembly Process Flow
  • Wafer Fabrication Unit
  • Packaging Process Flow & Assembly Unit

Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • CMOS FrontEnd Cost
  • MEMS Resonator FrontEnd Cost
  • MEMS Cap FrontEnd Cost
  • CMEMS/Cap Assembly Cost
  • MEMS FrontEnd Cost per process steps
  • MEMS FrontEnd: Equipment Cost per Family
  • MEMS FrontEnd: Material Cost per Family
  • Total Frontend Cost & Price
  • BackEnd 0 : Probe Test & Dicing
  • Wafer & Die Cost
  • BackEnd : Packaging & Final Test Cost
  • Si504 Component Cost

Estimated Price Analysis

  • Silicon Labs Financial Ratios
  • Si504 Estimated Price


For more information visit http://www.researchandmarkets.com/research/fpj6dd/silicon_labs


Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net


SOURCE Research and Markets

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