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Bosch Sensortec BMX055 9-Axis MEMS IMU - Reverse Costing Analysis

DUBLIN, February 6, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/9l2njj/bosch_sensortec) has announced the addition of the "Bosch Sensortec BMX055 9-Axis MEMS IMU - Reverse Costing Analysis" report to their offering.

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

The first 9-Axis MEMS IMU from Bosch for Consumer Applications
Combines 3-Axis Gyroscope, 3-Axis Accelerometer and 3-Axis Magnetometer

In the race of motion integration, Bosch Sensortec has released its first 9-Axis IMU for consumer applications. The BMX055 combines a 12-bit 3-Axis accelerometer, a 16bit 3-Axis gyroscope and a wide-range 3-Axis geomagnetic sensor in a 4.5x3.0mm LGA package (the smallest footprint at its introduction).

It is the first 9-Axis MEMS IMU where all the functionalities are developed and manufactured by the same player. The BMX055 integrates the second generation of Bosch geomagnetic sensor where the 3-Axis are integrated on a single die compared to 3 separates dies for the previous generation.

This report provides a complete teardown of the MEMS IMU with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth manufacturing cost analysis
  • Selling price estimation


Key Topics Covered:

Introduction, Bosch Company Profile

Physical Analysis

  • Package
  • Package Views, Dimensions & Pin Out
  • Package Opening
  • Wire bonding process
  • Package CrossSection
  • ASIC Gyro & Accelero Dies
  • View, Dimensions & Marking
  • Delayering
  • Main Blocks Identification
  • CrossSection
  • MEMS Gyro & Accelero Dies
  • View, Dimensions & Marking
  • Bond Pad Opening & Bond Pad
  • Cap Removed & Cap Details
  • Sensing Area Details
  • CrossSection (Sensor, Cap & Bonding)
  • Process Characteristics
  • Magnetometer Die
  • View, Dimensions & Marking
  • Hall sensor and fluxgate sensors
  • Delayering
  • Main Blocks Identification
  • CrossSection (CMOS & Sensor)

Manufacturing Process Flow

  • ASIC Gyro & Accelero FrontEnd Process
  • MEMS Gyro & Accelero Process Flow
  • Magnetometer Process Flow
  • Wafer Fabrication Unit
  • Packaging Process Flow
  • Package Assembly Unit

Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • ASIC Gyro & Accelero FrontEnd Cost
  • ASIC Gyro & Accelero BackEnd 0 : Probe Test & Dicing
  • ASIC Gyro & Accelero Wafer & Die Cost
  • MEMS Gyro & Accelero FrontEnd Cost
  • MEMS Gyro & Accelero BackEnd 0 : Probe Test & Dicing
  • MEMS Gyro & Accelero Wafer & Die Cost
  • Magnetometer CMOS FrontEnd Cost
  • Magnetometer Sensor Cost
  • Magnetometer BackEnd 0 : Probe Test & Dicing
  • Magnetometer Wafer & Die Cost
  • BackEnd : Packaging Cost
  • BackEnd : Final Test & Calibration Cost
  • BMX055 Component Cost

Estimated Price Analysis

For more information visit http://www.researchandmarkets.com/research/9l2njj/bosch_sensortec


Media Contact: Laura Wood , +353-1-481-1716, [email protected]


SOURCE Research and Markets

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