SYS-CON MEDIA Authors: Bob Gourley, Lori MacVittie, RealWire News Distribution, Cynthia Dunlop, Mark O'Neill

News Feed Item

Opportunities of EMC in Global Semiconductor Packaging Industry: Trends, Forecast and Opportunity Analysis to 2017

DUBLIN, Feb. 10, 2014 /PRNewswire/ --Research and Markets (http://www.researchandmarkets.com/research/j6hcgw/opportunities_of) has announced the addition of the "Opportunities of EMC in Global Semiconductor Packaging Industry: Trends, Forecast and Opportunity Analysis to 2017" report to their offering.

(Logo: http://photos.prnewswire.com/prnh/20130307/600769)

The epoxy molding compound (EMC) market in the semiconductor packaging industry has witnessed growth over the last five years. It is expected to continue its growth momentum and reach approximately US $1,702 million by 2017. Numerous factors influence the EMC market in the semiconductor packaging industry.

This research indicates that the industry has displayed cyclical behavior: During the upturn years, the generated profits are used to sustain operations during economic downturns. During upturn periods, however, investment is greater than demand, due to which growth is slow for a longer period during the downturn and the poor performers struggle. The companies holding greater market share are creating higher profits because they have closer relationships with key customers and possess better research and development processes that yield better innovations and a greater ability to maintain profit during downturns.

The composition for epoxy molding compound for encapsulation of semiconductors are epoxy resins, fused silica, coupling agent, hardener, flame retardants, curing promoters, release agent, and low stress additives. Previously, bisphenol-A was used as the epoxy resin; epoxy cresol novolac is now preferred over bisphenol-A because of better resistance to heat. Epoxy resin is preferred to produce EMC due to its unique attributes. In EMCs, the filler represents up to 75% by weight. Fillers provide mechanical strength to the EMC and reduce the thermal expansion coefficient, which reduces the shrinkage after molding.

The market research report provides an overview of trend scenarios and forecast statistics for 2012-2017; presents industry drivers and challenges; and opportunities for suppliers worldwide. This report will benefit manufacturers, material suppliers and the end user market.

This unique report will provide you with valuable information, insights, and tools needed to identify new growth opportunities and operate your business successfully in this market. This report will save hundreds of hours of your own personal research time and will significantly benefit you in expanding your business in this market. In today's stringent economy, you need every advantage that you can find.

Features of this Report:

To make business, investment, and strategic decisions, you need timely, useful information. This market report fulfills this core need and is an indispensable reference guide for multinational materials suppliers, product manufacturers, investors, executives, distributors, and many more that operate in this market.

Key Topics Covered:

1. Executive Summary

2. EMC Market Background and Classifications

3. Global EMC Market Analysis

4. EMC Market Trend

5. EMC Market Forecast

6. Growth Opportunities and Emerging Trends in EMC Market


For more information visit http://www.researchandmarkets.com/research/j6hcgw/opportunities_of

Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.