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iPhone 5S MEMS Knowles Microphone - Reverse Costing Analysis

DUBLIN, Feb. 24, 2014 /PRNewswire/ --Research and Markets (http://www.researchandmarkets.com/research/s97nds/iphone_5s_mems) has announced the addition of the "iPhone 5S MEMS Knowles Microphone - Reverse Costing Analysis" report to their offering.

(Logo: http://photos.prnewswire.com/prnh/20130307/600769)

In this version of Apple iPhone, Knowles succeeds in integrating two MEMS microphones out of the three present in the phone. The third microphone is from AAC Technologies which was also already present inthe previous iPhone 5.

Apple thus uses the same MEMS microphones suppliers for the iPhone 5S,but each of them modified the design and the manufacturing process of their components to improve them by making them more robust. Compared to the microphone used in the iPhone 5, Knowles major changes include the number of transducers of the MEMS die (impacting directly the die size) and the thickness of the backplate.

COMPLETE TEARDOWN WITH:

  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation

Key Topics Covered:

Glossary

Overview/Introduction

Companies Profile

iPhone 5S Teardown

Physical Analysis

  • Physical Analysis Methodology
  • Package
  • Package Views & Dimensions
  • Package Opening
  • Package Cross-Section
  • ASIC Die
  • View, Dimensions & Marking
  • Delayering, Process Identificatio- - Cross-Section
  • Process Characteristics
  • MEMS Die
  • View, Dimensions & Marking
  • Dicing
  • Bond Pads
  • Diaphragm & Backplate
  • Cavities
  • Anti-stiction features
  • Cross-Section

Manufacturing Process Flow

  • Global Overview
  • ASIC Front-End Process
  • ASIC Wafer Fabrication Unit
  • MEMS Process Flow
  • MEMS Wafer Fabrication Unit
  • Packaging Process Flow
  • Package Assembly Unit

Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test & Dicing
  • ASIC Wafer Cost
  • ASIC Die Cost
  • MEMS Front-End Cost
  • MEMS Back-End 0 : Probe Test & Dicing
  • MEMS Front-End Cost per process steps
  • MEMS Front-End: Equipment Cost per Family
  • MEMS Front-End: Material Cost per Family
  • MEMS Wafer Cost
  • MEMS Die Cost
  • Back-End : Packaging Cost
  • Back-End : Packaging Cost per Process Steps
  • Back-End : Final Test Cost
  • Microphone Component Cost & Price

For more information visit http://www.researchandmarkets.com/research/s97nds/iphone_5s_mems

Media Contact: Laura Wood , +353-1-481-1716, [email protected]

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