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CALIENT Technologies Executives to Speak at OFC 2014 Conference

CALIENT Technologies, Inc., the global leader for Optical Circuit Switching (OCS) technology, today announced that two company executives will speak as part of the OFC 2014 Conference, taking place March 9-13, 2014, at the Moscone Center in San Francisco.

Atiq Raza, CALIENT chairman and CEO, will participate as part of the “OIDA Photonics and SDN in the Data Center” panel on Sunday, March 9 at 4:00 p.m. Other panel members include Yuval Bachar of Facebook, Keren Bergman of Columbia University and Mike Schlansker of HP.

CALIENT Vice President of Marketing, Daniel Tardent, will present “Hybrid Packet OCS Connectivity in the Software Defined Data Center” at the SDN Symposia on Wednesday, March 12 at 1:45 p.m.

“Atiq has more than 30 years of experience and will therefore bring a very well-rounded perspective to the panel presentation,” said Tardent. “We’re pleased at the opportunity to share our knowledge as well as CALIENT’s exciting new developments at this year’s OFC.”

Also at the exhibition, CALIENT is partnering to present a new software controller that can monitor and move traffic flows between packet and optical circuit switched fabrics in a data center working with the company’s S320 Optical Circuit Switch. The presentation will be in CALIENT’s booth #302. This solution will allow data center operators to add 40Gbps and 100Gbps capacity at up to 10 times lower cost than pure packet-based solutions.

OFC is the largest global conference and exposition for optical communications and networking professionals. For more information, visit http://www.ofcconference.org/.

About CALIENT Technologies

CALIENT Technologies is the global leader in pure photonic Optical Circuit Switching with systems that enable dynamic optical-layer optimization in next-generation datacenters and software defined networks. CALIENT’s 3D MEMS switches allow datacenter operators to cost-effectively deploy 40 Gbit/s and 100 Gbit/s services at up to 10x lower cost than conventional packet-based solutions. The company designs and fabricates its systems using state of the art MEMS equipment in its own fabrication facility located at its corporate headquarters in Santa Barbara, California. For more information, visit us at http://www.calient.net, on Twitter and LinkedIn or contact us at [email protected].

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