SYS-CON MEDIA Authors: Pat Romanski, Kevin Benedict, Gilad Parann-Nissany, Michael Bushong, Eric Brown

News Feed Item

Infineon SP37 Tire Pressure Monitoring Sensor - Technology Analysis

DUBLIN, Ireland, March 13, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/vrgc69/infineon_sp37) has announced the addition of the "Infineon SP37 Tire Pressure Monitoring Sensor - Technology Analysis" report to their offering.
     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )


The latest generation of Infineon's TPMS, the SP37, is a highly integrated TPM sensor which embeds measurement of pressure and radial acceleration (2 DoF) with a low-power microcontroller, a LF receiver and an RF transmitter in a system in package integrating only two dies. This high integration of functions allows to build a complete system with few external components and thus enable system cost savings.

The SP37 inherits its MEMS technology from the acquisition of the Norwegian Sensonor in 2003. Therefore, highly reliable measurements in harsh environments are possible by the use of the mature and low-cost triple stack hermetic wafer bonding technology in combination with buried piezoresistors and conductors.

The SP37 is assembled in a Small Outline 14-pin package and operates under a temperature range of -40 to +125°C.

This report will provide a Physical Analysis & Manufacturing Process Flow.

A full reverse costing analysis report is also available, with a complete teardown of the TPMS.


Key Topics Covered:

PHYSICAL ANALYSIS

Physical Analysis Methodology

Package

  • Package Views, Dimensions & Marking
  • Package X-Ray
  • Package Opening
  • Package Cross-Section

ASIC Die

  • View, Dimensions & Marking
  • Delayering
  • Main Blocks
  • Cross-Section
  • Process Characteristics

MEMS Die

  • View, Dimensions & Marking
  • Bond Pad Opening & Bond Pad
  • Cap Removed
  • Sensing Area
  • Cross-Section:
  • Accelerometer Cross-Section
  • Pressure Sensor Cross-Section

MANUFACTURING PROCESS FLOW

  • Global Overview
  • ASIC Front-End Process
  • ASIC Wafer Fabrication Unit
  • MEMS Process Flow
  • MEMS Wafer Fabrication Unit
  • Packaging Process Flow & Assembly Unit


For more information visit http://www.researchandmarkets.com/research/vrgc69/infineon_sp37

About Research and Markets
Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.


Media Contact: Laura Wood , +353-1-481-1716, [email protected]


More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.