SYS-CON MEDIA Authors: Jason Bloomberg, Eric Brown, Bob Gourley, Sandi Mappic, RealWire News Distribution

News Feed Item

Bosch Sensortec BMC150 6-Axis MEMS eCompass Reverse Costing Analysis

DUBLIN, Ireland, March 13, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/4z4lzz/bosch_sensortec) has announced the addition of the "Bosch Sensortec BMC150 6-Axis MEMS eCompass Reverse Costing Analysis" report to their offering.
     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )


The BMC150 combines a 12-bit 3-Axis accelerometer and a wide-range 3-Axis geomagnetic sensor in a 2.2x2.2mm LGA package (the smallest footprint at its introduction). All the functionalities are developed and manufactured by Bosch.

Compared to its predecessor BMC050, the BMC150 achieve almost 50% footprint reduction. This reduction has been made possible by the integration of the second generation of Bosch geomagnetic sensor where the 3-Axis are integrated on a single die compared to 3 separates dies for the previous generation.

The magnetic sensor still uses Bosch FlipCore technology for X/Y-Axis sensing and Hall element for Z-Axis sensing. The MEMS accelerometer is also an evolution of the one found in BMC050.

The BMC150 is a very low power (190µA) and high resolution (0.3µT) 6-axis digital compass targeted for consumer mobile applications.

COMPLETE TEARDOWN WITH:

  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation


Key Topics Covered:

Glossary

Overview/Introduction , Bosch Company Profile

Physical Analysis

  • Package

-- Package Views, Dimensions & X-Ray
-- Package Opening
-- Wire bonding Process
-- Package Cross-Section

  • Accelerometer ASIC Die

-- View, Dimensions & Marking
-- Process Identification
-- Cross-Section

  • Accelerometer MEMS Die

-- View, Dimensions & Marking
-- Bond Pad Opening & Bond Pad
-- Cap Removed & Cap Details
-- Sensing Area Details
-- Cross-Section (Sensor, Cap & Bonding)
-- Process Characteristics

  • Magnetometer Die

-- View, Dimensions & Marking
-- Hall sensor and fluxgate sensors
-- Delayering
-- Main Blocks Identification
-- Cross-Section (CMOS & Sensor)

  • Manufacturing Process Flow

-- ASIC Accelero Front-End Process
-- MEMS Accelero Process Flow
-- Magnetometer Process Flow
-- Wafer Fabrication Unit
-- Packaging Process Flow
-- Package Assembly Unit

  • Cost Analysis

-- Main steps of economic analysis
-- Yields Hypotheses
-- ASIC Front-End Cost
-- ASIC Back-End 0 : Probe Test & Dicing
-- ASIC Wafer & Die Cost
-- MEMS Front-End Cost
-- MEMS Back-End 0 : Probe Test & Dicing
-- MEMS Wafer & Die Cost
-- Magnetometer CMOS Front-End Cost
-- Magnetometer Sensor Cost
-- Magnetometer Sensor Cost per process steps
-- Magnetometer Back-End 0 : Probe Test & Dicing
-- Magnetometer Wafer & Die Cost
-- Back-End : Packaging Cost
-- Back-End : Final Test Cost
-- BMC150 Component Cost

Estimated Price Analysis

For more information visit http://www.researchandmarkets.com/research/4z4lzz/bosch_sensortec


Media Contact: Laura Wood , +353-1-481-1716, [email protected]


More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.