SYS-CON MEDIA Authors: Adrian Bridgwater, Yeshim Deniz, Elizabeth White, Sean Houghton, Glenn Rossman

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Connectivity Chip Trends Analysis 2014

DUBLIN, April 1, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/zb7rsm/connectivity_chip) has announced the addition of the "Connectivity Chip Trends" report to their offering. 


     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

The report analyzes and presents an overview of Connectivity Chips market worldwide. The report in addition provides global market estimates and projections for Wireless Connectivity ICs in US dollars for years 2012 through 2017. 

Supported with 7 market data tables, the report provides a review of global market trends, technological advancements, and competitive scenario. The report highlights on various strategic industry activities of major companies witnessed by the industry over the last few years. 

In addition, 42 companies operating in the Connectivity Chips arena worldwide are profiled, including

  • Broadcom Corporation
  • CSR PLC
  • INSIDE Secure
  • Marvell Technology Group Ltd.
  • Qualcomm Atheros Inc.
  • Samsung Semiconductor Inc.
  • ST-Ericsson
  • Texas Instruments Inc.
  • Toumaz Microsystems


Key Topics Covered: 

1. CONNECTIVITY CHIPS - A MARKET OVERVIEW

  • A Prelude
  • Table 1: Global Wireless Connectivity ICs Market (2012-2017) in US$ Million
  • Table 2: Global Video-Oriented Consumer Electronics Devices Equipped with High-Bandwidth Wireless Solutions ICs (2012-2017) in Million Units
  • Wi-Fi-enabled Mobile Devices to Witness Robust Growth
  • Table 3: Global Wi-Fi-enabled Device Shipments (2012-2017) in Million Units
  • Increased Consumer Demand for Wi-Fi Mobile Devices Driving Growth in Semiconductor Industry
  • Key Factors Expected to Drive Wireless Connectivity Chips Market in Near Term
  • Increase in Consumer Interest for Wire-Free Solutions
  • Table 4: Global Bluetooth-Enabled Chip Shipments (2012-2017) in Million Units
  • Growing Use of Internet in Next-Generation Consumer Devices
  • Technological Advancements
  • Competitive Scenario
  • Table 5: Leading Connectivity Chip Producers' Market Share by Value Sales Worldwide (2012) - Percentage Breakdown for Broadcom, Texas Instruments, CSR PLC, Marvell Technology Group Ltd, and Others
  • Table 6: Leading Bluetooth Chip Producers' Market Share by Value Sales Worldwide (2012) - Percentage Breakdown for Broadcom, CSR PLC, Media Tek, RDA Microelectronics, and Others
  • Table 7: Leading GPS Chip Producers' Market Share by Value Sales Worldwide (2012) Percentage Breakdown for CSR Plc, u-blox AG, Texas Instruments, Broadcom, and Others

2. RECENT INDUSTRY ACTIVITY

  • Amazon.com to Take Over Mobile Processor Division of Texas Instruments
  • Samsung Acquires Handset Technology Development Division of CSR
  • Toumaz Establishes Toumaz Microsystems
  • Broadcom Takes Over NetLogic Microsystems
  • CSR Takes Over Zoran
  • Inside Secure Signs Agreement with Intel for NFC Technology
  • Qualcomm Acquires Atheros Communications
  • Texas Instruments Acquires National Semiconductor

3. PRODUCT LAUNCHES/INNOVATIONS 

  • Apple to Introduce 802.11ac Networking Capabilities in New Mac Models
  • Broadcom Launches New 5G WiFi Product Line
  • Broadcom Rolls Out BCM20732 Bluetooth® Smart System-on-Chip
  • Dialog Semiconductor Introduces DA14580 SmartBond System-on-Chip
  • Broadcom Introduces BCM4752 Location Architecture
  • Marvell and Atheros Independently Introduce Wi-Fi Chips
  • ST-Ericsson Introduces Mobile Connectivity Chips

4. MARKET PARTICIPANTS

  • Analog Devices, Inc. (USA)
  • Aquantia Corporation (USA)
  • ASIX Electronics Corporation (Taiwan)
  • Atmel Corporation (USA)
  • Beken Corporation (China)
  • Broadcom Corporation (USA)
  • Cadence Design Systems
  • Celeno Communications (Israel)
  • CellGuide Ltd. (Israel)
  • CSR PLC (UK)
  • Dialog Semiconductor
  • Freescale Semiconductor
  • Fujitsu Ltd. (Japan)
  • Gainspan Corporation
  • GCT Semiconductor
  • Glyn Ltd. (Australia)
  • INSIDE Secure (France)
  • Intel Corporation (USA)
  • Lantiq (Germany)
  • Marvell Technology Group Ltd. (Bermuda)
  • Maxim Integrated Products, Inc. (USA)
  • MediaTek, Inc. (Taiwan)
  • Microchip Technology, Inc. (USA)
  • Nordic Semiconductor ASA (Norway)
  • Nvidia Corporation (USA)
  • NXP Semiconductors NV
  • PMC-Sierra, Inc. (USA)
  • Qualcomm Atheros, Inc. (USA)
  • Quantenna Communications, Inc. (USA)
  • RDA Microelectronics (China)
  • Realtek Semiconductor Corporation (Taiwan)
  • Redpine Signals (USA)
  • Renesas Electronics Corporation (Japan)
  • RF Micro Devices, Inc. (USA)
  • Samsung Semiconductor, Inc. (USA)
  • Silicon Laboratories, Inc. (USA)
  • SkyTraq Technology, Inc. (Taiwan)
  • ST-Ericsson (Switzerland)
  • Telechips, Inc. (Korea)
  • Texas Instruments, Inc. (USA)
  • Toumaz Microsystems (UK)
  • u-blox

5. APPENDIX 

For more information visit http://www.researchandmarkets.com/research/zb7rsm/connectivity_chip


Media Contact: Laura Wood , +353-1-481-1716, [email protected]


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