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SYS-CON MEDIA Authors: Liz McMillan, Esmeralda Swartz, Hovhannes Avoyan, Elizabeth White, Adrian Bridgwater

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InvenSense MPU-9250 9-Axis MEMS IMU Technology Analysis

DUBLIN, April 2, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/9r5dkx/invensense) has announced the addition of the "InvenSense MPU-9250 9-Axis MEMS IMU Technology Analysis" report to their offering. 

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

For its second generation of 9 DoF sensor, InvenSense manages to integrate a 6-Axis Accelerometer/Gyroscope and a 3-Axis Magnetometer in a cost effective QFN package of only 3x3mm (45% footprint reduction compared to the previous generation).

This package reduction has been made possible thanks to a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefice of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.

The MPU-9250 also integrates a new 3-Axis magnetometer from AKM, the AK8963, which features almost 40% size reduction compared to previous generation and sensitivity improvement with 0.15µT/LSB. 

The Technology Analysis report contains only Physical Analysis & Manufacturing Process Flow. A full reverse costing analysis report is also available. For more information please click on the link below. 

Key Topics Covered: 

Physical Analysis

Package

  • Package Views & Dimensions
  • Package Opening
  • Wire bonding Process
  • Package Cross-Section

MPU-6500 Die

  • View, Dimensions & Marking
  • MEMS Removed
  • MEMS Sensing Area
  • MEMS Cap
  • ASIC Delayering & Process
  • Die Cross-Section: ASIC
  • Die Cross-Section: MEMS
  • Die Cross-Section: Sensor
  • Die Cross-Section: Cap

AK8963 Die

  • View, Dimensions & Marking
  • Hall Sensors
  • Delayering & Process
  • Die Cross-Section
  • Magnetic Concentrator Cross-Section

Comparison with previous generation

Manufacturing Process Flow

  • MPU-6500 ASIC Front-End Process
  • MPU-6500 MEMS Process Flow
  • AK8963 ASIC Front-End Process
  • AK8963 Magnetic Concentrator Process Flow
  • Wafer Fabrication Units
  • Packaging Process Flow & Assembly Unit

For more information visit http://www.researchandmarkets.com/research/9r5dkx/invensense

Media Contact: Laura Wood, +353-1-481-1716, [email protected]

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