SYS-CON MEDIA Authors: Kevin Benedict, Gilad Parann-Nissany, Michael Bushong

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Research and Markets: Review on the Development of Cross-Strait Semiconductor Industries

Research and Markets ( has announced the addition of the "Review on the Development of Cross-Strait Semiconductor Industries in 2013" report to their offering.

Driven by the Chinese government's preferential policies and enormous domestic market needs, international semiconductor vendors have constantly set up plants in China to strengthen their deployment. The movement has also contributed to the development of Chinese IC design houses, manufacturers, and packaging and testing vendors. As a result, the Chinese semiconductor industry has seen stunning growth since 2010, posing serious threats to the development of the Taiwanese semiconductor industry. This report will analyze the current status of Taiwanese and Chinese semiconductor industries as well as the existing and future development of the sub-industries in Taiwan and China.

Key Topics Covered:

1. Comparison of Cross-Strait Semiconductor Industry's Production Value and Structure

2. Comparison of Cross-Strait IC Design Industries

  • 2.1 Comparison of Industry Value
  • 2.2 Development of Top Ten IC Design Houses in China and Taiwan
  • 2.2.1 Smart Handheld Device Core IC Vendors
  • 2.2.2 Panel Driver IC Vendors
  • 2.2.3 Vendors in Other Industries

3.Comparison of Cross-Strait IC Manufacturing Industries

  • 3.1 Comparison of Industry Value
  • 3.2 Chinese IC Manufacturing Industry Clusters
  • 3.3 Development of Top Ten IC Manufacturers in China and Taiwan
  • 3.4 Comparison of Process Technologies and Production Capacity

4.Comparison of Cross-Strait IC Packaging and Testing Industries

  • 4.1 Comparison of Industry Value
  • 4.2 Chinese IC Packaging and Testing Industry Clusters
  • 4.3 Development of Top Ten IC Packaging and Testing Vendors in China and Taiwan
  • 4.3.1 Development of Taiwanese IC Packaging and Testing Vendors
  • 4.3.2 Development of Chinese IC Packaging and Testing Vendors
  • Perspectives
  • Competition of IC Design for Smart Handheld Devices Intensifies
  • Increased Competition in 28nm Process Technology with Steady 8-inch Wafer Demand

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