SYS-CON MEDIA Authors: Greg Schulz, Gilad Parann-Nissany, Kevin Benedict, RealWire News Distribution, Unitiv Blog

News Feed Item

Research and Markets: Apple iPhone 5S Camera Module 8Mpixel 1.5m Stacked BSI CIS from Sony - Technology Analysis

Research and Markets (http://www.researchandmarkets.com/research/h6gc5h/apple_iphone_5s) has announced the addition of the "Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony - Technology Analysis" report to their offering.

For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm.

The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the previous CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs.

The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.

Key Topics Covered:

CAMERA MODULE SUPPLY CHAIN & COMPANIES PROFILE

Physical Analysis

Camera Module

- Camera Module View & Dimensions

- Camera Module X-Ray

- Camera Module Disassembly

CMOS Image Sensor

- View & Dimensions

- Pads, Tungsten Grid

- TSV Connections

- CIS Pixels

- Logic Circuit (Transistors, SRAM)

Cross-Section: Camera Module

- Overview

- Driver (Assembly & Process) & MLCC

- Ceramic Substrate, IR Filter & FPC

- Lenses, Housing, VCM

Cross-Section: CMOS Image Sensor

- Overview

- Pad Trenches

- Pixel Array Circuit

- Logic Circuit

- TSVs

Comparison with previous 8Mpixel CIS from OVT, Samsung and Sony

CIS MANUFACTURING PROCESS FLOW

Global Overview

Logic Circuit Front-End Process

Pixel Array Circuit Front-End Process

BSI + TSV + Microlenses Process

CIS Wafer Fabrication Unit

For more information visit http://www.researchandmarkets.com/research/h6gc5h/apple_iphone_5s

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.