SYS-CON MEDIA Authors: Sean Houghton, Glenn Rossman, Ignacio M. Llorente, Xenia von Wedel, Peter Silva

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TRADE NEWS: Agilent Technologies Announces Advanced Modeling Solutions for Nanoscale 3D FinFETs and High-Frequency/High-Power GaN HEMTs

Agilent Technologies Inc. (NYSE:A) today announced several innovations for the 2014 release of its industry-leading suite of device modeling and characterization software tools. The suite comprises Agilent EEsof EDA’s Integrated Circuits Characterization and Analysis Program (IC-CAP), Model Builder Program (MBP), and Model Quality Assurance (MQA).

“Over the past few years, we’ve steadily expanded our device modeling platform through internal development and acquisition of key technologies,” said Brian Chen, Agilent’s device modeling planning manager. “This marks the first release of our entire portfolio and represents a significant advancement toward our vision of being a partner that uniquely delivers a complete end-to-end, measurement-to-modeling solution.”

Advanced Modeling Capabilities

The new software release features three advanced device modeling packages for Agilent’s DynaFET, BSIM6, and BSIM-CMG models.

BSIM6 is the industry-standard model for bulk MOSFETs, offering important improvements for analog/RF applications over its predecessor, BSIM4. BSIM-CMG is the industry-standard model for sub-20 nm 3-D FinFET technologies. Modeling solutions for both BSIM6 and BSIM-CMG in the 2014 release are designed to help the semiconductor industry understand and use these new technologies.

The DynaFET modeling package is based on internally developed technology and is an integral part of Agilent’s GaN HEMT characterization, modeling and simulation solution. The GaN HEMT modeling package provides a GUI-based turnkey solution for DynaFET model generation.

Using artificial neural networks for charge and current formulations, and incorporating trapping/de-trapping and self-heating effects, the time-domain DynaFET model is capable of fitting accurately to DC, linear and large-signal measurement data—all simultaneously. This allows a single model file to be used for the design of different applications under various bias conditions, all with accurate simulation results.

Additional Enhancements

The 2014 device modeling and characterization software release also provides a number of new and enhanced features designed to noticeably improve productivity across the end-to-end work flow of device characterization, model generation and model validation. These enhancements include:

  • a programming editor;
  • faster simulation speed with major simulators;
  • expanded mismatch and variation modeling solutions; and
  • a streamlined and flexible user interface to create, manage, monitor, and debug measurement test plans.

U.S. Pricing and Availability

Agilent’s 2014 device modeling and characterization software release will be available in July.

More information on the 2014 release of IC-CAP, MBD and MQA software is available at www.agilent.com/find/eesof-iccap, www.agilent.com/find/eesof-mbp and www.agilent.com/find/eesof-mqa, respectively. Images of the software are available at www.agilent.com/find/DeviceModeling_2014_images.

About IC-CAP Software

Agilent IC-CAP software is a device-modeling program that delivers powerful characterization and analysis capabilities for today’s semiconductor modeling processes. Providing efficient and accurate extraction of active device and circuit model parameters, IC-CAP performs numerous modeling tasks, including instrument control, data acquisition, graphical analysis, simulation and optimization. It is used by semiconductor foundries and design houses to characterize foundry processes. For more information on IC-CAP, visit www.agilent.com/find/eesof-iccap.

About MBP Software

Model Builder Program (MBP) is a one-stop solution that provides both automation and flexibility for high-volume, high-throughput device modeling. MBP includes powerful, built-in characterization and modeling capabilities as well as an open interface for modeling strategy customization. It is widely used both by semiconductor foundries and design houses to extract and customize SPICE model libraries. For more information, visit www.agilent.com/find/eesof-mbp.

About MQA Software

Model Quality Assurance (MQA) provides the complete solution and framework to fabless design companies, IDMs and foundries for SPICE model library validation, comparison, and documentation. MQA has become a de facto industry-standard SPICE model QA tool. MQA performs model QA, comparison, and documentation automatically to ensure design success using advanced process technologies. For more information about MQA, visit www.agilent.com/find/eesof-mqa.

About Agilent EEsof EDA Software

Agilent EEsof EDA is the leading supplier of electronic design automation software for microwave, RF, high-frequency, high-speed digital, RF system, electronic system level, circuit, 3-D electromagnetic, physical design and device-modeling applications. More information is available at www.agilent.com/find/eesof.

About Agilent Technologies

Agilent Technologies Inc. (NYSE:A) is the world’s premier measurement company and a technology leader in chemical analysis, life sciences, diagnostics, electronics and communications. The company’s 20,600 employees serve customers in more than 100 countries. Agilent had revenues of $6.8 billion in fiscal 2013. Information about Agilent is available at www.agilent.com.

On Sept. 19, 2013, Agilent announced plans to separate into two publicly traded companies through a tax-free spinoff of its electronic measurement business. The new company is named Keysight Technologies, Inc. The separation is expected to be completed in early November 2014.

NOTE TO EDITORS: Further technology, corporate citizenship and executive news is available at www.agilent.com/go/news.

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