SYS-CON MEDIA Authors: Pat Romanski, Sean Houghton, Glenn Rossman, Ignacio M. Llorente, Xenia von Wedel

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SPTS Technologies and CEA-Leti / Nanoelec RTI collaborate on 3D-TSV Technology

SPTS Technologies, a leading manufacturer of etch, deposition and thermal processing equipment for the semiconductor industry, today announced that it has signed an agreement with CEA-Leti in Grenoble, France, to develop 3D-TSV technologies The two-year agreement enters under the framework of the Nanoelec Research Technology Institute program which is led by CEA-Leti, and covers co-development of a range of deposition processes for next-generation 3D high aspect ratio through-silicon-via (TSV) solutions. The agreement builds on the long established relationship between the partners who have already collaborated in the past, particularly on the development and optimization of an advanced MOCVD TiN barrier for high aspect ratio TSV.

3D packaging of semiconductor devices, using TSVs to connect stacked die, is accepted as a critical technology to deliver industry performance goals without exceeding power budgets. To scale future 3D devices, new techniques will be needed to manufacture TSV’s of smaller diameter and higher aspect ratio than are used today. Under this agreement, SPTS and CEA-Leti aim to develop production worthy solutions to address these challenges. Previous collaboration has resulted in a number of key advancements in the formation of TSVs using SPTS’ deep reactive ion etch (DRIE), chemical vapor deposition (CVD) and physical vapor deposition (PVD). One of the key achievements includes optimization of an advanced metal organic chemical vapor deposition (MOCVD) TiN barrier for high aspect ratio TSV.

“The results previously achieved keeps SPTS at the forefront of 3D-TSV development,” said Kevin Crofton, president and chief operating officer of SPTS. “In partnership with CEA-Leti, we plan now to develop technology and processes that will further extend TSV aspect ratios beyond 20:1, with a particular focus on developing an MOCVD copper process as a seed layer to replace ionized PVD.”

“The work with SPTS and other partners will create solutions that will be transferred into industry,” said Dr. Laurent Malier, CEO of CEA-Leti and President of the Nanoelec RTI board. “Combining Leti’s integration expertise with the specific process knowledge of successful equipment manufacturers like SPTS enables innovation and allows us to create an optimised, cost-effective process flow for volume manufacturing of 3D-IC devices.”

About SPTS Technologies

SPTS Technologies (a Bridgepoint portfolio company) designs, manufactures, sells, and supports etch, PVD, CVD and thermal wafer processing solutions for the MEMS, advanced packaging, LEDs, high speed RF on GaAs, and power management device markets. With manufacturing facilities in Newport, Wales, Allentown, Pennsylvania, and San Jose, California, the company operates across 19 countries in Europe, North America and Asia-Pacific. For more information about SPTS Technologies, please visit www.spts.com

About CEA-Leti (France)

By creating innovation and transferring it to industry, Leti is the bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. Backed by its portfolio of 2,200 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched more than 50 startups. Its 8,000m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. Leti’s staff of more than 1,700 includes 200 assignees from partner companies. Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo. Leti is heading the Nanoelec RTI program which benefits from French State aid under the “Programme Investissements d’Avenir” agreement bearing reference ANR-10-AIRT-05. For more information, visit www.leti.fr & www.irtnanoelec.fr.

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