|By Business Wire||
|August 26, 2014 09:30 PM EDT||
Mitsubishi Engineering-Plastics Corporation (Head Office: Minato-ku, Tokyo; President Hiroshi Urabe) has developed a high-dielectric resin with improved up to approximately eight relative permittivity.
By applying special formulation, the resin has realized little dielectric anisotropy and a low loss of 0.01 or less in dissipation factor while being high dielectric.
In recent years, mobile terminals, such as a smartphone and a tablet, become highly-functional and downsized, and the space allocated for antenna of wireless communications becomes smaller and smaller. The relative permittivity of the conventional resin is as small as around three, and it is impossible to design a small antenna. Therefore, there is a strong need for a resin with high permittivity.
We prepare two types using polycarbonate or modified-polyphenylenether as a base resin, and customers can select depending on their intended applications and their manufacturing process. Our high-dielectric resin is ideal for base material of miniaturized antenna.
Mitsubishi Engineering-Plastics Corporation
1-9-2 Higashi-shinbashi, Minato-ku, Tokyo 105-0021, Japan
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