SYS-CON MEDIA Authors: Pat Romanski, Gary Arora, Zakia Bouachraoui, Yeshim Deniz, Liz McMillan

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SC18 Exhibitor Profiles

SC18 takes place 12 - 15 November, 2018 at the Kay Bailey Hutchinson Convention Center in Dallas. Please note the following important information.

#SC18 Exhibitor News and Press Kits:

Information for Media:

Business Wire is the official news wire for SC18. Listed below are exhibitor profiles.

Company: Ace Computers
Booth: 2606

Ace Computers has been headquartered in Greater Chicago since 1983 and is a market leader in all HPC-related hardware solutions, including digital forensic workstations and servers. They are also an award-winning systems integrator. Ace is a Mellanox and Supermicro partner, an Intel Platinum Technology Provider and an NVIDIA Preferred Partner. Its HPC clusters, Powerworks™ servers and LogiCAD™ workstations for AI/DL applications are fully optimized for immediate deployment. The company is an experienced Federal Agency Prime Contractor, with major NASA SEWP V, U.S. Air Force and GSA Schedule 70 contracts and the only HPC-focused vendor with a Prime NASPO ValuePoint contract.
Company: AIC
Booth: 4153
AIC is a leading provider of both standard OTS (off-the-shelf) and OEM/ODM server and storage solutions. With expert in-house design, manufacturing and validation capabilities, AIC's broad selection of products are highly flexible and configurable to any form factor, standard or custom. AIC leads the industry with over 20 years of experience in mechanical, electronic, system-level engineering as well as a dedication to innovation and customer satisfaction. Headquartered in Taiwan, AIC has offices and operations throughout the United States, Asia and Europe.
Company: Asetek
Booth: 2233
Ticker Symbol & Exchange: ASETEK.OL
Asetek® is the leader in flexible, reliable and proven liquid cooling for high performance computing (HPC) and artificial intelligence (AI).
Asetek’s latest heat rejection technologies include:
-InRackLAAC™ solution for air-cooled data centers, which enables extreme performance at high densities without the need to change the existing facility infrastructure
-4U InRackCDU™, capable of rejecting up to 80kW per rack to facilities water
-Intel® Compute Modules that include Asetek direct-to-chip (D2C) liquid cooling technology, validated and factory installed by Intel
Founded in 2000, Asetek (ASETEK.OL) is headquartered in Denmark and has operations in the U.S., Europe, China and Taiwan.
Company: ENYX
Booth: 240
ENYX is a leading developer and provider of ultra-low latency FPGA-enabled technologies and solutions for the financial, telecommunications, and high performance computing industries.
Focused on delivering higher performance with a lower datacenter footprint, Enyx provides both off-the-shelf trading and telecom solutions, as well as pre-built hardware IP blocks compatible with FPGA platforms. Additionally, by providing standard programming interfaces, Enyx's products offer timely integration and deployment into the customer's infrastructure.
With a passion for customer service and transparency, Enyx designs products made to deliver the next generation of technology, while maintaining accessibility and flexibility.
Enyx offers FPGA-enabled solutions to our clients worldwide with offices located in Paris, New York, Chicago and Hong Kong.
Company: Ethernet Alliance
Booth: 307
The Ethernet Alliance is a global consortium of system and component vendors, industry experts, university and government professionals committed to continuing success and expansion of Ethernet technology. Working in support of IEEE 802™ standards, and related standard-based Ethernet products, the Ethernet Alliance is the industry leader in fostering and promoting Ethernet interoperability globally. With Ethernet driving game-changing innovations across the technology landscape, from datacenters to individuals streaming on mobile devices, the Ethernet Alliance works to advance the Ethernet Ecosystem, and ongoing development across the rate spectrum to bolster existing and emerging applications and markets fueled by higher Ethernet speed demands.
Company: Inspur
Booth: 1235
Ticker Symbol & Exchange: 000977 (Shenzhen)
Inspur Group is China's leading cloud computing, big data service provider comprised of: Inspur Information, Inspur Software, Inspur International and Inspur Huaguang, addressing cloud data center, cloud services and big data, smart city, and smart enterprise markets with comprehensive solutions in IaaS, PaaS, and SaaS.
With high-end servers, mass storage, cloud operating system and information security technology, Inspur helps customers build leading platforms underpinned by cloud computing infrastructure. Its information software, terminal products, and solutions, enable Inspur to fully support governments, enterprises, and industries in cloud construction. Inspur ships IT products and services to over 113 countries globally.
Company: IntelliProp, Inc.
Booth: 4145
IntelliProp, a data storage solutions company develops licensable Intellectual Property (IP) cores, highly integrated IP Products and full-chip ASSP product solutions. Available IP Cores include interface protocol solutions for SATA, NVMe, SAS, Gen-Z and special function IPs such as Encryption, ECC and NVDIMM Flash Management for integration in FPGA and ASIC designs. IntelliProp also has completed multiple full chip ASSP solutions which are available as turnkey products. SSD NAND controllers, Gen-Z Memory Controllers and various high-performance Protocol and RAID Bridges are among the available solutions. IntelliProp products may be viewed at and they may be contacted at [email protected].
Company: Kitware, Inc
Booth: 3735
Kitware develops open source software to efficiently visualize and analyze data at scale so your team can turn that data into actionable insight. As one of the primary contributors to the open source Visualization Toolkit (VTK), ParaView, and CMake, Kitware is working closely with customers and collaborators to build the foundation for exascale visualization. These long-standing software toolkits and applications are part of the exascale ecosystem and offer critical benefits such as in situ analysis and revolutionary tech stacks to evolve with the next generation of computing. Stop by the Kitware booth for live presentations highlighting ParaView, VTK, and more.
Company: Molex
Booth: 3941
Molex develops high-speed solutions that solve complex technical and business challenges for the world’s innovators by anticipating and delivering what our customers need most. From a globally integrated approach to seamless collaboration, we bring expertise and innovation together to help bring your product vision to reality. With manufacturing and design facilities around the world, our operations work closely with yours to deliver results that leverage our heritage of innovation in interconnect technology, and bring unparalleled expertise to the complex electronic solutions of tomorrow. Come visit us at booth 3941!
Company: Netcope Technologies
Booth: 834
Netcope Technologies is a leading provider of P4 programmable acceleration for FPGA-based network solutions. We operate globally with offices in San Jose, CA and Brno, Czechia. P4 for FPGAs enables easy programmability of smart network adapters without expert knowledge of FPGA chips and puts control into the hands of network architects. We embrace open source through contributions to P4, DPDK and ONF projects and hardware neutrality by supporting FPGAs of both leading vendors Intel and Xilinx.
Company: OpenMP ARB
Booth: 2203
The mission of the OpenMP ARB is to standardize directive-based, multi-language, high-level, parallelism that is performant, productive, and portable. Jointly defined by a group of computer hardware vendors, software vendors, and research institutes, the OpenMP API is a model that gives parallel programmers a simple interface for developing parallel applications for platforms including embedded systems, systems including accelerator devices, and multicore systems. We are releasing OpenMP version 5.0 at SC’18. Join us in booth 2203 for a 5.0 reference guide, presentations, and giveaways, to meet OpenMP ARB members, and to enter a drawing to win an OpenMP book.
Company: Oracle
Booth: 2806
Ticker Symbol & Exchange: NYSE: ORCL
Oracle Cloud Infrastructure is an enterprise Infrastructure as a Service (IaaS) platform. Companies of all sizes rely on Oracle Cloud to run enterprise and cloud native applications with mission-critical performance and core-to-edge security. By running both traditional and new workloads on a comprehensive cloud that includes compute, storage, networking, database, and containers, Oracle Cloud Infrastructure can dramatically increase operational efficiency and lower total cost of ownership. Oracle Cloud is designed with high performance computing as one of the core use-cases, suitable for any compute intensive workload. For more information, visit
Company: Panasas, Inc.
Booth: 1613
Panasas delivers high-performance storage trusted by the world’s leading companies for their most innovative HPC projects. Panasas storage eliminates the compromise of fast or simple and instead offers both: unmatched performance and the plug-and-play capabilities that emerging use cases require. Whether it’s advancing genomic research, monitoring climate change, or supporting the latest AI applications, Panasas customers know their data is accessible, secure, and easily managed. The Panasas ActiveStor® solution provides a data storage infrastructure that goes from dock to data in one day, is consistently fast, easily adapts to changing workloads and increasing demands, and features the industry’s lowest administration overhead.
Company: Quantum Corporation
Booth: 4023
Ticker Symbol & Exchange: NYSE: QTM
Quantum is a global leader in high-performance storage and intelligent data management solutions. Engineered for large, rich media workflows, Quantum’s StorNext® is the industry’s leading high-performance shared storage file system and archive platform; providing a unique combination of performance, low-cost capacity and accessibility for research staff worldwide.
Scientists and analysts need intelligent data management throughout their research workflow. Quantum’s multi-tier storage enables teams to harness their data and accelerate discoveries. The Xcellis™ shared storage appliance is at the core of Quantum’s scale-out storage portfolio. Powered by StorNext, Xcellis makes high-performance disk, object storage, tape and the public cloud behave as one seamless, easy-to-manage storage environment.
Company: Rescale
Booth: 4123
Rescale is the global leader for enterprise big compute. Trusted by the Global Fortune 500, Rescale empowers the world’s top executives, IT leaders, engineers, and scientists to securely manage product innovation and perform groundbreaking research and development faster at a lower cost. Rescale’s ScaleX® platform solutions transform traditional fixed IT resources into flexible hybrid, private, and public cloud resources—built on the largest and most powerful high performance computing infrastructure network in the world. Rescale offers hundreds of turnkey software applications on the platform which are instantly cloud enabled for the enterprise. For more information on Rescale, visit
Company: Xilinx
Booth: 927
Ticker Symbol & Exchange: NASDAQ: XLNX
Xilinx develops highly flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies – from the endpoint to the edge to the cloud. Xilinx is the inventor of the FPGA, hardware programmable SoCs and the ACAP, designed to deliver the most dynamic processor technology in the industry and enable the adaptable, intelligent and connected world of the future. For more information, visit

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