SYS-CON MEDIA Authors: Pat Romanski, Liz McMillan, Yeshim Deniz, Elizabeth White, Courtney Abud

News Feed Item

Leading the way in compute and networking solutions: TE Connectivity to present high-speed innovations at DesignCon 2019

Live demos will showcase a broad range of next-generation system solutions

HARRISBURG, Pa., Jan. 17, 2019 /PRNewswire/ -- TE Connectivity (TE), a world leader in connectivity and sensors, will again educate and inspire system designers at DesignCon this year by demonstrating a new array of innovative solutions for next-generation compute and networking systems. TE will demonstrate more than half a dozen industry-leading high-speed data communications connectivity solutions in booth 817 at the DesignCon 2019 expo on Jan. 30-31 in Santa Clara, California.

TE Connectivity Ltd. Logo. (PRNewsfoto/TE Connectivity)

In addition, on Jan. 31 at 2 p.m. at the conference, TE technologists Nathan Tracy and Bruce Champion will present "Delivering 100 Gbps Solutions for Chip to Module (C2M) & Direct Attach Copper (DAC) Cable Implementations." Efforts are underway to define 100 Gbps channels to support simpler, lower cost versions of 100G, 200G and 400G Ethernet as well as enable 800G Ethernet links. This presentation describes C2M and various DAC configurations to give concrete evidence on what system designers can expect going forward for 100 Gbps channels. The presentation will include details of the analyzed channel impairments that need to be addressed and some of the methodologies employed to develop a sound solution that can support these next-generation physical solutions for the channel, connectors and cables.

Each year, the TE team demonstrates the company's leadership in compute and high-speed connectivity solutions at DesignCon. TE's featured live demos in its booth will include:

800G OSFP Passive Copper Cable Link
The 112 Gbps DAC Cable link will demonstrate a live 112 Gbps PAM4 electrical signal running over 2 meters of passive copper cabling to include crosstalk aggressors. This channel will utilize a 112 Gbps PAM-4 serializer/deserializer (SerDes) chip driving and receiving traffic through the Octal Small Form Factor Pluggable (OSPF) surface mount (OSFP SMT) connector which is a pluggable form factor with eight high speed electrical lanes. This demonstration will highlight the connector's ability to run each of these 8 lanes at 112 Gbps for a total aggregate data rate 896 Gbps per connector over 2 meters of copper cable. With the OSFP form factor capable of allowing a density of up to 32 ports per 1 rack-unit (RU) front panel, this technology can enable 28.6 Tbps per 1RU.

112G Cable Enabled Architectures
As data rates prepare to migrate to 100 Gbps signaling, the insertion loss of a printed circuit board-based channel threatens standard equipment architectures. This demo showcases the technologies from TE that can enable 100G based architectures to be successful from signal integrity, thermal and packaging perspectives.  Included in this demo are STRADA Whisper cabled backplane connectors, Sliver internal cable assemblies and OSFP direct attach copper (DAC) cable assemblies - all helping to realize typical 100G chip-to-chip, card-to-card and equipment-to-equipment based high speed connections. These TE products enable interconnecting links to provide necessary bit error rates (BERs) for 100G data that could be required for these demanding next-gen architectures.

56G Large Scale LGA Socket
TE's extra large array XLA socket series provides high speed "LGA contact" signal performance. The growing size of large silicon packages has pushed the manufacturing of traditional plastic sockets beyond established molding limits. The XLA series is a hybrid LGA socket that solders directly to the motherboard. This hybrid socket technology utilizes a superior PCB substrate carrier allowing for reliable attachment to the mother board.  A key feature of the XLA technology is its ability to address extremely large packages, in excess of 100mm x 100mm.  This demonstration presents live 56G PAM4 signal performance over 1 channel with 3 aggressors.

QSFP-DD Thermal Bridge
The Quad Small Form Factor Pluggable Double Density (QSFP-DD) compressible thermal bridge demo presents a new technology for efficiently transferring heat across a gap of variable size, while controlling the force applied to surrounding components. The demo displays bridge and interface thermal resistances in real time, while allowing adjustment of the bridge height as heat is transferred between a pluggable module and heat sink.

32G Sliver Connector for Drive Link
This demonstration includes TE's Sliver SFF SMT orthogonal connector with pre-standard PCIe Gen5 32G host-to-solid state drive (SSD) link demonstrates 32 Gbps NRZ live traffic with zero errors over a 35dB loss channel with multiple crosstalk aggressors. The demo shows how TE's Sliver connectors compliant with the SFF-TA-1002 specification can be utilized for EDSFF and SSD devices in server and storage appliances.

3m+ QSFP-DD 400G Passive Copper Cable Link - The QSFP-DD DAC demo shows a passive copper cable assembly.  The channel is running at 56 Gb/s over more than 3 meters of passive copper cable with an acceptable bit error rate (BER). The Quad Small Form Factor Pluggable Double Density, or QSFP-DD, form factor has 8 lanes providing an aggregate throughput of 448 Gbps through a single cable assembly. The QSFP-DD interface is backwards compatible with QSFP, allowing several generations of QSFP modules to be plugged into the same interface.  

SFP-DD 100G PAM4 Passive Copper Cable Link
The Small Form Factor Pluggable Double Density (SFP-DD) passive direct attach copper (DAC) cable link demonstrates a live 56Gbps PAM4 electrical interface. This interface consists of two channels utilizing a 56G PAM-4 SerDes chip driving and receiving traffic over a 28AWG SFP-DD direct attach copper (DAC) cable link.  The data is transported through a Small Form Factor Pluggable Double Density Surface Mount (SFP-DD SMT) connector which is a pluggable form factor with two high speed electrical lanes. Offering backward compatibility to current SFP style interfaces, this demonstration highlights the SFP-DD connector and DAC's ability to run each of these 2 lanes at 56Gbps for a total aggregate data rate of 112 Gbps per connector, thus doubling the current limit of SFP style interfaces while also providing backwards compatibility with SFP DACs.

QSFP-DD 12.8T Switch > 15W Thermal Performance
The QSFP-DD thermal demo consists of a 1RU enclosure with 32 ports of the QSFP-DD 400Gbps input/output (I/O) populated with thermal emulator modules. The demo allows programmable control of airflow and per module power dissipation levels up to 15 Watts, demonstrating realistic operation of a 12.8Tbps 1RU enclosure.

TE power connectors, cable assemblies and value-added bus bar solutions
These products provide simple yet customizable designs that enable a standardized platform capable of efficiently distributing up to 500A of power per UL and CSA criteria, while offering improved electrical performance. Engineered solutions support multiple voltage requirements, low resistance and low milli-volt drop. Designers can realize operational and overall system cost savings with TE power products that support low energy consumption. These products are compatible with specifications for use in rack-level bus bar applications including power shelves, battery backup unit (BBU) shelves, IT trays and server sleds.

"As we move toward higher speeds in the data center, equipment requires new approaches to connectivity and thermal management," said Nathan Tracy, Technologist at TE Connectivity's data and devices business unit and president of the Optical Internetworking Forum (OIF).  "Each year at DesignCon, TE demonstrates its industry leadership in developing new technologies and products for next-generation data center and networking equipment, and we are proud to be showcasing our latest technical advances via functioning electrical, thermal and power demonstrations and displays at DesignCon 2019."

Learn more on TE's DesignCon 2019 events page.

TE Connectivity Ltd. is a $14 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at and on LinkedIn, Facebook, WeChat and Twitter.

TE Connectivity, TE, TE connectivity (logo), and EVERY CONNECTION COUNTS are trademarks owned or licensed by the TE Connectivity Ltd. family of companies. Other logos, product(s) and/or company names might be trademarks of their respective owners.

Cision View original content to download multimedia:

SOURCE TE Connectivity

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
Implementation of Container Storage Interface (CSI) for Kubernetes delivers persistent storage for compute running in Kubernetes-managed containers. This future-proofs Kubernetes+Storage deployments. Unlike the Kubernetes Flexvol-based volume plugin, storage is no longer tightly coupled or dependent on Kubernetes releases. This creates greater stability because the storage interface is decoupled entirely from critical Kubernetes components allowing separation of privileges as CSI components do n...
With container technologies widely recognized as the cloud-era standard for workload scaling and application mobility, organizations are increasingly seeking to support container-based workflows. In particular, the desire to containerize a diverse spectrum of enterprise applications has highlighted the need for reliable, container-friendly, persistent storage. However, to effectively complement today's cloud-centric container orchestration platforms, persistent storage solutions must blend relia...
Applications with high availability requirements must be deployed to multiple clusters to ensure reliability. Historically, this has been done by pulling nodes from other availability zones into the same cluster. However, if the cluster failed, the application would still become unavailable. Rancher’s support for multi-cluster applications is a significant step forward, solving this problem by allowing users to select the application and the target clusters, providing cluster specific data. Ranc...
AI and machine learning disruption for Enterprises started happening in the areas such as IT operations management (ITOPs) and Cloud management and SaaS apps. In 2019 CIOs will see disruptive solutions for Cloud & Devops, AI/ML driven IT Ops and Cloud Ops. Customers want AI-driven multi-cloud operations for monitoring, detection, prevention of disruptions. Disruptions cause revenue loss, unhappy users, impacts brand reputation etc.
JFrog, the DevOps technology leader known for enabling liquid software via continuous update flows, was honored today with two prestigious awards as part of's annual DevOps Dozen. The awards recognized both JFrog Artifactory as the "Best DevOps Commercial Solution" and JFrog Co-Founder and CEO, Shlomi Ben Haim, as the "Best DevOps Solution Provider Executive". holds the DevOps Dozen awards annually to recognize the best of the best in the global DevOps marketplace.
Eggplant, the customer experience optimization specialist, announced the latest enhancements to its Digital Automation Intelligence (DAI) Suite. The new capabilities augment Eggplant’s continuous intelligent automation by making it simple and quick for teams to test the performance and usability of their products as well as basic functionality, delivering a better user experience that drives business outcomes.
Is advanced scheduling in Kubernetes achievable?Yes, however, how do you properly accommodate every real-life scenario that a Kubernetes user might encounter? How do you leverage advanced scheduling techniques to shape and describe each scenario in easy-to-use rules and configurations? In his session at @DevOpsSummit at 21st Cloud Expo, Oleg Chunikhin, CTO at Kublr, answered these questions and demonstrated techniques for implementing advanced scheduling. For example, using spot instances and co...
Conor Delanbanque has been involved with building & scaling teams in the DevOps space globally. He is the Head of DevOps Practice at MThree Consulting, a global technology consultancy. Conor founded the Future of DevOps Thought Leaders Debate. He regularly supports and sponsors Meetup groups such as DevOpsNYC and DockerNYC.
As you know, enterprise IT conversation over the past year have often centered upon the open-source Kubernetes container orchestration system. In fact, Kubernetes has emerged as the key technology -- and even primary platform -- of cloud migrations for a wide variety of organizations. Kubernetes is critical to forward-looking enterprises that continue to push their IT infrastructures toward maximum functionality, scalability, and flexibility. As they do so, IT professionals are also embr...
At CloudEXPO Silicon Valley, June 24-26, 2019, Digital Transformation (DX) is a major focus with expanded DevOpsSUMMIT and FinTechEXPO programs within the DXWorldEXPO agenda. Successful transformation requires a laser focus on being data-driven and on using all the tools available that enable transformation if they plan to survive over the long term. A total of 88% of Fortune 500 companies from a generation ago are now out of business. Only 12% still survive. Similar percentages are found throug...
The use of containers by developers -- and now increasingly IT operators -- has grown from infatuation to deep and abiding love. But as with any long-term affair, the honeymoon soon leads to needing to live well together ... and maybe even getting some relationship help along the way. And so it goes with container orchestration and automation solutions, which are rapidly emerging as the means to maintain the bliss between rapid container adoption and broad container use among multiple cloud host...
Today most companies are adopting or evaluating container technology - Docker in particular - to speed up application deployment, drive down cost, ease management and make application delivery more flexible overall. As with most new architectures, this dream takes significant work to become a reality. Even when you do get your application componentized enough and packaged properly, there are still challenges for DevOps teams to making the shift to continuous delivery and achieving that reducti...
Here to help unpack insights into the new era of using containers to gain ease with multi-cloud deployments are our panelists: Matt Baldwin, Founder and CEO at StackPointCloud, based in Seattle; Nic Jackson, Developer Advocate at HashiCorp, based in San Francisco, and Reynold Harbin, Director of Product Marketing at DigitalOcean, based in New York. The discussion is moderated by Dana Gardner, principal analyst at Interarbor Solutions.
Skeuomorphism usually means retaining existing design cues in something new that doesn’t actually need them. However, the concept of skeuomorphism can be thought of as relating more broadly to applying existing patterns to new technologies that, in fact, cry out for new approaches. In his session at DevOps Summit, Gordon Haff, Senior Cloud Strategy Marketing and Evangelism Manager at Red Hat, discussed why containers should be paired with new architectural practices such as microservices rathe...
In 2014, Amazon announced a new form of compute called Lambda. We didn't know it at the time, but this represented a fundamental shift in what we expect from cloud computing. Now, all of the major cloud computing vendors want to take part in this disruptive technology. In his session at 20th Cloud Expo, John Jelinek IV, a web developer at Linux Academy, will discuss why major players like AWS, Microsoft Azure, IBM Bluemix, and Google Cloud Platform are all trying to sidestep VMs and containers...