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Tessera to Speak on 3D Packaging in Mobile Phones at Annual BiTS Workshop

Tessera to Speak on 3D Packaging in Mobile Phones at Annual BiTS Workshop

Tessera Technologies, Inc. (Nasdaq:TSRA), a leading provider of miniaturization technologies for the electronics industry, today announced that Belgacem Haba, chief technology officer of Advanced Packaging and Interconnect (AP&I) for Tessera, has been invited to speak on 3D packaging in mobile phones at the ninth annual Burn-in & Test Socket (BiTS) Workshop held March 9-12, 2008, in Mesa, Arizona.

The annual BiTS Workshop connects leading industry users and suppliers in a forum that provides the latest information about burn-in and test socketing and related technologies. Haba’s presentation, “Catching the Mobile Wave: Packaging is Going 3D,” will focus on the trend of miniaturization in the next-generation of communication and entertainment products. Haba will also address how the explosion of the cell phone market is a testament to the increase of functionality and complexity of miniaturization as consumers demand smaller, lighter devices with more features and capabilities.

WHO:

  Belgacem Haba, CTO of AP&I for Tessera
 

WHAT:

Ninth Annual BiTS Workshop
 

WHERE:

Hilton Phoenix East/Mesa
Mesa, AZ

http://www.bitsworkshop.org

 

WHEN:

Sunday, March 9 at 8:30 p.m. MT

About Tessera

Tessera Technologies, Inc. is a leading provider of miniaturization technologies for the electronics industry. The company provides a broad range of advanced packaging, interconnect, and consumer optics solutions which are widely adopted in high-growth markets including consumer, computing, communications, medical and defense electronics. Tessera’s customers include the world’s top semiconductor companies such as Intel, Samsung, Texas Instruments, Toshiba, Micron and Infineon. The company’s stock is traded on the Nasdaq National Market under the symbol TSRA. Tessera is headquartered in San Jose, California. For information call 1.408.894.0700 or go to www.tessera.com.

Safe Harbor Statement

This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected. Material factors that may cause results to differ from the statements made include delays, setbacks or losses relating to our intellectual property or intellectual property litigations, or any invalidation or limitation of our key patents; fluctuations in our operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect our ability to protect our intellectual property; the risk of a decline in demand for semiconductor products; failure by the industry to adopt our technologies; competing technologies; the future expiration of our patents; the future expiration of our license agreements and the cessation of related royalty income; the failure or refusal of licensees to pay royalties; failure to achieve the growth prospects and synergies expected from acquisition transactions; and delays and challenges associated with integrating acquired companies with our existing businesses. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. Tessera's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended December 31, 2006 and its Quarterly Report on Form 10-Q for the quarter ended September 30, 2007 include more information about factors that could affect the company's financial results.

Tessera and the Tessera logo are registered trademarks of Tessera. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

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